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6N138

产品描述1 CHANNEL LOGIC OUTPUT OPTOCOUPLER
产品类别光电子/LED    光电   
文件大小20KB,共2页
制造商SIEMENS
官网地址http://www.infineon.com/
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6N138概述

1 CHANNEL LOGIC OUTPUT OPTOCOUPLER

6N138规格参数

参数名称属性值
厂商名称SIEMENS
包装说明PLASTIC, DIP-8
Reach Compliance Codeunknown
其他特性CMOS COMPATIBLE, UL RECOGNIZED
配置SINGLE
最大正向电流0.02 A
最大绝缘电压2500 V
元件数量1
最大通态电流0.06 A
最高工作温度100 °C
最低工作温度-55 °C
光电设备类型LOGIC IC OUTPUT OPTOCOUPLER
Base Number Matches1

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6N138
6N139
LOW INPUT CURRENT, HIGH GAIN
OPTOCOUPLER
FEATURES
• High Current Transfer Ratio, 800%
• Low Input Current, 0.5mA
• High Output Current, 60mA
• Isolation Test Voltage, 2500 VAC
RMS
• TTL Compatible Output, VOL=0.1 V
• High Common Mode Rejection, 500V/
µ
sec.
• Adjustable Bandwidth–Access to Base
• Standard Molded Dip Plastic Package
• Underwriters Lab File #E52744
APPLICATIONS
• Logic Ground Isolation–TTL/TTL, TTL/CMOS,
CMOS/CMOS, CMOS/TTL
• EIA RS 232C Line Receiver
• Low Input Current Line Receiver–Long Lines,
Party Lines
• Telephone Ring Detector
• 117 VAC Line Voltage Status Indication–Low
Input Power Dissipation
• Low Power Systems–Ground Isolation
DESCRIPTION
High common mode transient immunity and very
high current ratio together with 2500 VAC insulation
are achieved by coupling an LED with an integrated
high gain photo detector in an eight pin dual-in-line
package. Separate pins for the photodiode and out-
put stage enable TTL compatible saturation volt-
ages with high speed operation. Photodarlington
operation is achieved by tying the V
CC
and V
O
ter-
minals together. Access to the base terminal allows
adjustment to the gain bandwidth.
The 6N138 is ideal for TTL applications since the
300% minimum current transfer ratio with an LED
current of 1.6 mA enables operation with one unit
load-in and one unit load-out with a 2.2 K
pull-up
resistor.
The 6N139 is best suited for low power logic appli-
cations involving CMOS and low power TTL. A
400% current transfer ratio with only 0.5 mA of LED
current is guaranteed from 0
°
C to 70
°
C.
Caution:
Due to the small geometries of this device, it should be
handled with Electrostatic Discharge (ESD) precau-
tions. Proper grounding would prevent damage further
and/or degradation which may be induced by ESD.
Dimensions in inches (mm)
4
3
2
1
Pin
One
I.D.
NC 1
2
8
7
6
5
.305 typ.
(7.75) typ.
VCC
VB
V0
GND
.268 (6.81)
.255 (6.48)
Anode
Cathode 3
5
6
7
8
.390 (9.91)
.379 (9.63)
.045 (1.14)
.030 (.76)
.150 (3.81)
.130 (3.30)
Typ.
.022 (.56)
.018 (.46)
.040 (1.02)
.030 (.76 )
.100 (2.54) Typ.
10
°
Typ.
NC 4
.135 (3.43)
.115 (2.92)
3°–9°
.012 (.30)
.008 (.20)
Maximum Ratings
Reverse Input Voltage ..........................................................................5 V
Supply and Output Voltage, V
CC
(pin 8-5), V
O
(pin 6-5)
6N138 ................................................................................... –0.5 to 7 V
6N139 ................................................................................. –0.5 to 18 V
Emitter-Base Reverse Voltage (pin 5-7) ............................................0.5 V
Average Input Current.....................................................................20 mA
Peak Input Current (50% Duty Cycle–1 ms pulse width) ................40 mA
Peak Transient Input Current (tp
1
µ
sec, 300 pps ...........................1.0 A
Output Current I
O
(pin 6) .................................................................60 mA
Derate linearly above 25
°
C, free air temperature at 0.7 mA/
°
C
Input Power Dissipation .................................................................35 mW
Derate linearly above 50%, free air temperature at 0.7 mW/
°
C
Output Power Dissipation.............................................................100 mW
Derate linearly above 25
°
C, free air temperature at 0.2 mA/
°
C
Isolation Test Voltage........................................................... 2500 VAC
RMS
Isolation Resistance
V
IO
=500 V, T
A
=25
°
C
.........................................................................≥
10
12
V
IO
=500 V, T
A
=100
°
C
.......................................................................≥
10
11
Storage Temperature......................................................–55
°
C to +125
°
C
Operating Temperature ..................................................–55
°
C to +100
°
C
Lead Soldering Temperature (t=10 sec.) ........................................260
°
C
5–1

 
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