Advance Information

| 68HC912DG128 | 68HC12 | 68HC912DG128PV8 | 68HC912DG128VPV8 | 68HC12DG128CPV8 | 68HC12DG128PV8 | 68HC12DG128MPV8 | 68HC12DG128VPV8 | 68HC912DG128MPV8 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Advance Information | Advance Information | Advance Information | Advance Information | Advance Information | Advance Information | Advance Information | Advance Information | Advance Information |
| 厂商名称 | - | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | - | - | LQFP, QFP112,.87SQ | LQFP, QFP112,.87SQ | TQFP-112 | LQFP, QFP116,.87SQ | TQFP-112 | TQFP-112 | LQFP, QFP112,.87SQ |
| Reach Compliance Code | - | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 具有ADC | - | - | YES | YES | NO | NO | NO | NO | YES |
| 地址总线宽度 | - | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | - | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大时钟频率 | - | - | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| DAC 通道 | - | - | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | - | - | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | - | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | - | - | S-PQFP-G112 | S-PQFP-G112 | S-PQFP-G112 | S-PQFP-G112 | S-PQFP-G112 | S-PQFP-G112 | S-PQFP-G112 |
| 长度 | - | - | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| I/O 线路数量 | - | - | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
| 端子数量 | - | - | 112 | 112 | 112 | 112 | 112 | 112 | 112 |
| 最高工作温度 | - | - | 70 °C | 105 °C | 85 °C | 70 °C | 125 °C | 105 °C | 125 °C |
| 最低工作温度 | - | - | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| PWM 通道 | - | - | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | - | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | - | - | FLASH | FLASH | MROM | MROM | MROM | MROM | FLASH |
| 座面最大高度 | - | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 速度 | - | - | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | - | - | HCMOS | HCMOS | CMOS | CMOS | CMOS | CMOS | HCMOS |
| 温度等级 | - | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | - | - | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| uPs/uCs/外围集成电路类型 | - | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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