Flow-through mode.When low, enables flow-through mode. Connect to V
CC
if unused or for
STATIC
pipelined operation.
ASYNC
Sleep. Places device in low power mode; data is retained. Connect to GND if unused.
19
† These controls apply to the 7C33232F only, When using the 7C33232, pin 14 should be tied high and pin 64 should be tied low.
Absolute maximum ratings
Parameter
Power supply voltage relative to GND
Input voltage relative to GND (input pins)
Input voltage relative to GND (I/O pins)
Power dissipation
DC output current
Storage temperature (plastic)
Temperature under bias
Symbol
V
CC
V
IN
P
D
I
OUT
T
stg
T
bias
Min
–0.5
–0.5
–0.5
–
–
–65
–65
Max
+4.6
+6.0
VCC+0.5
1.2
30
+150
+135
Unit
V
V
V
W
mA
o
C
o
C
NOTE: Stresses greater than those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions may affect reliability.
Capacitance
1
Parameter
Input capacitance
I/O capacitance
Symbol
C
IN
C
I/O
Signals
Address and control pins, MODE, ZZ
I/O pins
Test Conditions
V
in
= 0V
V
in
= V
out
= 0V
Max
5
7
Unit
pF
pF
3
AS7C33232
AS7C33232F
Synchronous truth table
CE1
H
L
L
L
L
L
L
L
L
X
X
X
X
H
H
H
H
L
X
H
X
H
CE2
X
L
L
X
X
H
H
H
H
X
X
X
X
X
X
X
X
H
X
X
X
X
CE3
X
X
X
H
H
L
L
L
L
X
X
X
X
X
X
X
X
L
X
X
X
X
ADSP
X
L
H
L
H
L
L
H
H
H
H
H
H
X
X
X
X
H
H
X
H
X
ADSC
L
X
L
X
L
X
X
L
L
H
H
H
H
H
H
H
H
L
H
H
H
H
ADV
X
X
X
X
X
X
X
X
X
L
L
H
H
L
L
H
H
X
L
L
H
H
WRITEn
†
X
X
X
X
X
F
F
F
F
F
F
F
F
F
F
F
F
T
T
T
T
T
OE
X
X
X
X
X
L
H
L
H
L
H
L
H
L
H
L
H
X
X
X
H
H
Address Accessed
NA
NA
NA
NA
NA
External
External
External
External
Next
Next
Current
Current
Next
Next
Current
Current
External
Next
Next
Current
Current
CLK
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
L to H
Operation
Deselect
Deselect
Deselect
Deselect
Deselect
Begin read
Begin read
Begin read
Begin read
Cont. read
Cont. read
Suspend read
Suspend read
Cont. read
Cont. read
Suspend read
Suspend read
Begin write
Cont. write
Cont. write
Suspend write
Suspend write
Key: X = Don’t Care, L = LOW, H = HIGH, T = TRUE, F = FALSE.
†
See write enable truth table for detailed information.
DC operating conditions
Parameter
Input leakage current
Symbol
|
I
LI
|
Test Conditions
V
CC
= Max, V
in
= GND to V
CC
OE
≥
V
IH,
V
CC
= Max,
V
out
= GND to V
CC
CE1 = V
IL
, CE2 = V
IH
, CE3 = V
IL
,
f
=
f
max,
I
out
= 0 mA
Deselected,
f
=
f
max
Deselected,
f
=
0,
all V
IN
≤
0.2V or
≥
V
CC
- 0.2V
ZZ > V
IH
I
OL
= 5 mA, V
CC
= Max
I
OH
= –5 mA, V
CC
= Min
-10
Min Max
–
2
–
–
–
–
–
–
2.4
2
200
30
6
4
0.4
–
-13
Min Max
–
2
–
–
–
–
–
–
2.4
2
180
30
6
4
0.4
–
-15
Min Max
–
2
–
–
–
–
–
–
2.4
2
150
30
6
4
0.4
–
-17
Min Max
–
2
–
–
–
–
–
–
2.4
2
140
30
6
4
0.4
–
Unit
µA
µA
mA
mA
mA
mA
V
V
Output leakage current
|
I
LO
|
Operating power
supply current
Standby power supply
current
I
CC14
I
SB
I
SB1
I
SB2
V
OL
V
OH
Output voltage
Shaded areas contain preliminary information.
4
AS7C33232
AS7C33232F
Recommended operating conditions
Parameter
Supply voltage
I/O supply voltage
Address and
control pins
I/O pins
Ambient operating temperature
* V
IL
min = –2.0V for pulse width less than t
RC
/2.
Applicable to all portions of this specification unless otherwise noted.
Symbol
V
CC
GND
V
CCQ
GND
Q
V
IH
V
IL
V
IH
V
IL
T
a
Min
3.0
0.0
3.0
0.0
2.0
–0.5
*
2.0
-0.5
*
0
Nominal
3.3
0.0
3.3
0.0
–
–
–
–
–
Max
3.6
0.0
3.6
0.0
5.5
0.8
V
CC
+0.5
0.8
70
Unit
V
V
V
V
V
V
V
°C
Input voltage
Package dimensions
PQFP
θ
b
e
A2
A1
TQFP
max
min
max
MO–136
0.05
0.15
1.35
1.45
0.22
0.38
0.09
0.20
13.90
14.10
0.65
19.90
20.10
15.90
16.10
21.90
22.10
0.45
0.75
1.00
0°
7°
min
JEDEC
A1
A2
b
c
D
e
E
Hd
He
L
L1
q
100 Lead Quad Flatpack
PQFP (14mm × 20mm)
D Hd
L1
L
E
He
c
MO–108
0.25
0.45
2.57
2.87
0.20
0.40
0.10
0.20
13.90
14.10
0.65
19.90
20.10
17.00
17.40
23.00
23.40
0.65
0.95
1.60
0°
10°
PCB land pattern
This land pattern accommodates
both PQFP and TQFP packages.
C2
D2
Y
C1 D1
A
B
G1 Z1
X
e
D
G2
Z2
Notes
1
2
3
4
Pad requirement to accommodate two package types is larger than for one package type.
All dimensioning and tolerancing conform to ANSI Y14.5M-1982. Dimensions in mm.
Datums A--B and --D-- to be determined from the center two leads.
Based on the surface mount Design and Land Pattern Standard in IPC-SM-782 rev. A,
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