REVISIONS
LTR
A
B
C
DESCRIPTION
Changes in accordance with NOR 5962-R003-98.
Changes in accordance with NOR 5962-R042-98.
Add radiation features in section 1.4. In table IA: Change test conditions of V
IN
for I
IL
and I
LI
tests; add I
IL
and I
LI
tests for XTAL1 input; add footnote 7/ to t
CHCX
,
t
CLCX
, t
CLCH
, and t
CHCL
; change footnote 6/. Add pin connections for case outline
Y in figure 5. Editorial changes throughout. - TVN
Update the boilerplate in accordance with the requirements of MIL-PRF-38535.
– TVN
Make boilerplate corrections on sheets 2, 4, and 23 - 29. Remove rescinded
JEDEC Std 17 and replace with EIA/JESD 78 on sheet 4. – CFS
Change the SEU LET threshold from a minimum of 14 MeV/(mg/cm ) to
20 MeV/(mg/cm ). – CFS
G
Update boilerplate to current MIL-PRF-38535 requirements, including Radiation
Hardness Assurance boilerplate paragraphs. – CFS
08-01-23
Thomas M. Hess
2
2
DATE (
YR-MO-DA
)
97-10-31
98-02-26
99-07-26
APPROVED
Monica L. Poelking
Monica L. Poelking
Monica L. Poelking
D
E
F
01-04-11
02-11-06
03-06-12
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
G
15
G
16
G
17
G
18
REV
SHEET
G
19
G
20
G
21
G
1
G
22
G
2
G
23
G
3
G
24
G
4
G
25
G
5
G
26
G
6
G
27
G
7
G
28
G
8
G
29
G
9
G
10
G
11
G
12
G
13
G
14
PMIC N/A
PREPARED BY
Thomas M. Hess
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
95-12-13
REVISION LEVEL
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL, RADIATION HARDENED,
8-BIT MICROCONTROLLER, MONOLITHIC SILICON
SIZE
CAGE CODE
A
G
SHEET
1
67268
OF
29
5962-95638
DSCC FORM 2233
APR 97
5962-E135-08
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
H
95638
01
Q
Q
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
69RH051
Circuit function
Radiation hardened 8-bit microcontroller
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Q
Y
Descriptive designator
GDIP1-T40 or CDIP2-T40
See figure 1
Terminals
40
44
Package style
Dual-in-line
Quad flatpack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95638
SHEET
G
2
1.3 Absolute maximum ratings.
1/
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+ 0.3 V dc
15 mA
750 mW
-65°C to +150°C
+300°C
See MIL-STD-1835
175°C
Input voltage, V
DD
to V
SS
...........................................................................................
Voltage on any pin to V
SS
..........................................................................................
I
OL
per output pin ........................................................................................................
Maximum power dissipation (P
D
)................................................................................
Storage temperature range (T
STG
)..............................................................................
Lead temperature (soldering, 10 seconds).................................................................
Thermal resistance, junction-to-case (θ
JC
) .................................................................
Maximum junction temperature (T
J
) ...........................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
DD
) ........................................................................................ +4.5 V dc to +5.5 V dc
Case operating temperature range (T
C
) ..................................................................... -55°C to +125°C
1.5 Radiation features.
Total dose (dose rate = 50 - 300 rads(Si)/s)...............................................................
Single event phenomenon (SEP) effective:
Threshold LET, no upsets ...................................................................................
Threshold LET, no latchup ..................................................................................
Dose rate upset (20 ns pulse) ....................................................................................
Dose rate latchup .......................................................................................................
Dose rate survivability ................................................................................................
Neutron irradiated ......................................................................................................
1.6 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, method 5012) ............................................................ 94.92 percent
≥
1 x 10
6
rads(Si)
2
≥
20 MeV/(mg/cm ) 2/
2
≥
126 MeV/(mg/cm ) 2/
Not tested 3/
Not tested 3/
Not tested 3/
Not tested 3/
__________
1/
2/
3/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Limits are guaranteed by design or process but not production tested unless specified by the customer through the purchase
order or contract.
When characterized as a result of the procuring activities request, the condition will be specified.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-95638
SHEET
G
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103
MIL-HDBK-780
-
-
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by
Heavy Ion Irradiation of Semiconductor Devices.
(Copies of this document are available online at
http://www.astm.org/
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA 19428-2959.)
ELECTRONICS INDUSTRIES ALLIANCE (EIA)
ANSI JESD 78 -
IC Latch-up Test.
(Copies of this document is available online at
www.jedec.org/
or from the Electronics Industries Alliance, 2500 Wilson
Boulevard, Arlington, VA 22201-3834).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95638
SHEET
G
4
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and on figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figures 4.
3.2.5 Radiation exposure connections. The radiation exposure connections shall be as specified on figure 5.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 105 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95638
SHEET
G
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
