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5962-0153301TXC

产品描述SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68
产品类别存储    存储   
文件大小206KB,共14页
制造商Cobham Semiconductor Solutions
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5962-0153301TXC概述

SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-0153301TXC规格参数

参数名称属性值
厂商名称Cobham Semiconductor Solutions
零件包装代码QFP
包装说明QFF,
针数68
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最长访问时间25 ns
其他特性8 AND 16 BIT OPERATION IS ALSO POSSIBLE
备用内存宽度24
JESD-30 代码S-CQFP-F68
JESD-609代码e4
长度22.352 mm
内存密度16777216 bit
内存集成电路类型SRAM MODULE
内存宽度32
功能数量1
端子数量68
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-40 °C
组织512KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QFF
封装形状SQUARE
封装形式FLATPACK
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class T
座面最大高度5.2324 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层GOLD
端子形式FLAT
端子节距1.27 mm
端子位置QUAD
宽度22.352 mm
Base Number Matches1

5962-0153301TXC相似产品对比

5962-0153301TXC 5962P0153301TXC 5962-0153301QXC 5962L0153301TXC 5962D0153301TXC 5962D0153301QXC 5962P0153301QXC 5962L0153301QXC UT8Q512K32-SPC UT8Q512K32-SWC
描述 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68 SRAM Module, 512KX32, 25ns, CMOS, CQFP68, CERAMIC, QFP-68
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 QFF, QFF, QFF, QFF, QFF, QFF, QFF, QFF, QFF, QFF,
针数 68 68 68 68 68 68 68 68 68 68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A991.B.2.A 3A991.B.2.A
最长访问时间 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns
其他特性 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE 8 AND 16 BIT OPERATION IS ALSO POSSIBLE
备用内存宽度 24 24 24 24 24 24 24 24 24 24
JESD-30 代码 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68 S-CQFP-F68
长度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
内存宽度 32 32 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 68 68 68 68 68 68 68 68 68 68
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 QFF QFF QFF QFF QFF QFF QFF QFF QFF QFF
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm 5.2324 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
宽度 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
厂商名称 Cobham Semiconductor Solutions - Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions Cobham Semiconductor Solutions
JESD-609代码 e4 e4 e4 e4 e4 e4 e4 e4 - -
筛选级别 MIL-PRF-38535 Class T MIL-PRF-38535 Class T MIL-PRF-38535 Class Q MIL-PRF-38535 Class T MIL-PRF-38535 Class T MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q MIL-PRF-38535 Class Q - -
端子面层 GOLD GOLD GOLD GOLD GOLD GOLD GOLD GOLD - -
Base Number Matches 1 1 1 1 1 1 1 1 - -
总剂量 - 30k Rad(Si) V - 50k Rad(Si) V 10k Rad(Si) V 10k Rad(Si) V 30k Rad(Si) V 50k Rad(Si) V - -

 
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