Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDSO14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LG Semicon Co Ltd |
包装说明 | SOP, SOP14,.25 |
Reach Compliance Code | unknown |
Base Number Matches | 1 |
GD74HCT125D | GD74HC125J | GD74HC125 | GD74HC125D | GD54HCT125J | GD74HCT125 | GD74HCT125J | |
---|---|---|---|---|---|---|---|
描述 | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDSO14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDSO14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, PDIP14, | Bus Driver, 1-Func, 4-Bit, True Output, CMOS, CDIP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
包装说明 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
控制类型 | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 代码 | - | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
位数 | - | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | - | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | - | DIP | DIP | SOP | DIP | DIP | DIP |
封装等效代码 | - | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
电源 | - | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | - | 30 ns | 30 ns | 30 ns | 40 ns | 35 ns | 35 ns |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | - | NO | NO | YES | NO | NO | NO |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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