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GD74HC643

产品描述Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDIP20,
产品类别逻辑    逻辑   
文件大小225KB,共5页
制造商LG Semicon Co Ltd
下载文档 详细参数 选型对比 全文预览

GD74HC643概述

Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDIP20,

GD74HC643规格参数

参数名称属性值
是否Rohs认证不符合
Reach Compliance Codeunknown
控制类型COMMON CONTROL
计数方向BIDIRECTIONAL
JESD-30 代码R-PDIP-T20
JESD-609代码e0
最大I(ol)0.006 A
位数8
功能数量1
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP20,.3
封装形状RECTANGULAR
封装形式IN-LINE
电源2/6 V
Prop。Delay @ Nom-Sup28 ns
认证状态Not Qualified
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
Base Number Matches1

GD74HC643相似产品对比

GD74HC643 GD74HC643J GD74HC643D GD54HCT643J GD54HC643J GD74HCT643D GD74HCT643J GD74HCT643
描述 Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDIP20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, CDIP20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDSO20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, CDIP20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, CDIP20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDSO20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, CDIP20, Bus Driver/Transceiver, 1-Func, 8-Bit, Complementary Output, CMOS, PDIP20,
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
控制类型 COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL
计数方向 BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
JESD-30 代码 R-PDIP-T20 R-XDIP-T20 R-PDSO-G20 R-XDIP-T20 R-XDIP-T20 R-PDSO-G20 R-XDIP-T20 R-PDIP-T20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
最大I(ol) 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A
位数 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端子数量 20 20 20 20 20 20 20 20
最高工作温度 85 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -55 °C -55 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
封装代码 DIP DIP SOP DIP DIP SOP DIP DIP
封装等效代码 DIP20,.3 DIP20,.3 SOP20,.4 DIP20,.3 DIP20,.3 SOP20,.4 DIP20,.3 DIP20,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE
电源 2/6 V 2/6 V 2/6 V 5 V 2/6 V 5 V 5 V 5 V
Prop。Delay @ Nom-Sup 28 ns 28 ns 28 ns 38 ns 32 ns 32 ns 32 ns 32 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO NO YES NO NO YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 - - -

 
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