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HN58X2502TIE: 产品描述Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory; 产品类别存储存储; 文件大小168KB，共22页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HN58X2502TIE概述

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X2502TIE规格参数

参数名称	属性值
厂商名称	Renesas(瑞萨电子)
零件包装代码	SOIC
包装说明	4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
最大时钟频率 (fCLK)	3 MHz
JESD-30 代码	R-PDSO-G8
长度	4.4 mm
内存密度	2048 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	256 words
字数代码	256
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256X8
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL
认证状态	Not Qualified
座面最大高度	1.1 mm
串行总线类型	SPI
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
宽度	3 mm
最长写入周期时间 (tWC)	8 ms

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HN58X2502I

HN58X2504I

Serial Peripheral Interface

2k EEPROM (256-word

8-bit)

4k EEPROM (512-word

8-bit)

Electrically Erasable and Programmable Read Only Memory

REJ03C0061-0200

Rev.2.00

Jul.05.2005

Description

HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and

Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing

advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 16-byte

page programming function to make it’s write operation faster.

Note: Renesas Technology’s serial EEPROM are authorized for using consumer applications such as cellular phones,

camcorders, audio equipments. Therefore, please contact Renesas Technology’s sales office before using

industrial applications such as automotive systems, embedded controllers, and meters.

Features

•

Single supply: 1.8 V to 5.5 V

•

Serial Peripheral Interface compatible (SPI bus)



SPI mode 0 (0,0), 3 (1,1)

•

Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)

•

Power dissipation:



Standby: 3

µA

(max)



Active (Read): 2 mA (max)



Active (Write): 2.5 mA (max)

•

Automatic page write: 16-byte/page

•

Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)

•

Endurance: 10

Erase/Write Cycles

•

Data retention: 10 Years

•

Small size packages: SOP-8pin, TSSOP-8pin

•

Shipping tape and reel



TSSOP-8pin: 3,000 IC/reel



SOP-8pin

: 2,500 IC/reel

•

Temperature range:

−40

+85 °C

•

Lead free product.

Rev.2.00, Jul.05.2005, page 1 of 20

HN58X2502TIE相似产品对比

	HN58X2502TIE	HN58X2502FPIE	HN58X2502I	HN58X2504I	HN58X2504FPIE	HN58X2504TIE
描述	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
零件包装代码	SOIC	SOIC	-	-	SOIC	SOIC
包装说明	4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8	3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8	-	-	3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8	4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8
针数	8	8	-	-	8	8
Reach Compliance Code	compli	compliant	-	-	compli	compli
ECCN代码	EAR99	EAR99	-	-	EAR99	EAR99
最大时钟频率 (fCLK)	3 MHz	3 MHz	-	-	3 MHz	3 MHz
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	-	-	R-PDSO-G8	R-PDSO-G8
长度	4.4 mm	4.89 mm	-	-	4.89 mm	4.4 mm
内存密度	2048 bi	2048 bit	-	-	4096 bi	4096 bi
内存集成电路类型	EEPROM	EEPROM	-	-	EEPROM	EEPROM
内存宽度	8	8	-	-	8	8
功能数量	1	1	-	-	1	1
端子数量	8	8	-	-	8	8
字数	256 words	256 words	-	-	512 words	512 words
字数代码	256	256	-	-	512	512
工作模式	SYNCHRONOUS	SYNCHRONOUS	-	-	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	-	-	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-	-	-40 °C	-40 °C
组织	256X8	256X8	-	-	512X8	512X8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	SOP	-	-	SOP	TSSOP
封装形状	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	-	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	-	-	SERIAL	SERIAL
认证状态	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified
座面最大高度	1.1 mm	1.73 mm	-	-	1.73 mm	1.1 mm
串行总线类型	SPI	SPI	-	-	SPI	SPI
最大供电电压 (Vsup)	5.5 V	5.5 V	-	-	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	1.8 V	-	-	1.8 V	1.8 V
标称供电电压 (Vsup)	2.5 V	2.5 V	-	-	2.5 V	2.5 V
表面贴装	YES	YES	-	-	YES	YES
技术	CMOS	CMOS	-	-	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	-	-	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	-	-	GULL WING	GULL WING
端子节距	0.65 mm	1.27 mm	-	-	1.27 mm	0.65 mm
端子位置	DUAL	DUAL	-	-	DUAL	DUAL
宽度	3 mm	3.9 mm	-	-	3.9 mm	3 mm
最长写入周期时间 (tWC)	8 ms	8 ms	-	-	8 ms	8 ms

HN58X2502TIE

HN58X2502TIE概述

HN58X2502TIE规格参数

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HN58X2502TIE相似产品对比

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