Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

| HN58X2504I | HN58X2502FPIE | HN58X2502I | HN58X2504FPIE | HN58X2504TIE | HN58X2502TIE | |
|---|---|---|---|---|---|---|
| 描述 | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory |
| 零件包装代码 | - | SOIC | - | SOIC | SOIC | SOIC |
| 包装说明 | - | 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 | - | 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 | 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8 | 4.40 X 3 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-8 |
| 针数 | - | 8 | - | 8 | 8 | 8 |
| Reach Compliance Code | - | compliant | - | compli | compli | compli |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | - | 3 MHz | - | 3 MHz | 3 MHz | 3 MHz |
| JESD-30 代码 | - | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | - | 4.89 mm | - | 4.89 mm | 4.4 mm | 4.4 mm |
| 内存密度 | - | 2048 bit | - | 4096 bi | 4096 bi | 2048 bi |
| 内存集成电路类型 | - | EEPROM | - | EEPROM | EEPROM | EEPROM |
| 内存宽度 | - | 8 | - | 8 | 8 | 8 |
| 功能数量 | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | - | 8 | 8 | 8 |
| 字数 | - | 256 words | - | 512 words | 512 words | 256 words |
| 字数代码 | - | 256 | - | 512 | 512 | 256 |
| 工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | - | 256X8 | - | 512X8 | 512X8 | 256X8 |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | - | SOP | TSSOP | TSSOP |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | - | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.73 mm | - | 1.73 mm | 1.1 mm | 1.1 mm |
| 串行总线类型 | - | SPI | - | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | - | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | - | YES | - | YES | YES | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | - | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | DUAL | - | DUAL | DUAL | DUAL |
| 宽度 | - | 3.9 mm | - | 3.9 mm | 3 mm | 3 mm |
| 最长写入周期时间 (tWC) | - | 8 ms | - | 8 ms | 8 ms | 8 ms |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved