IRF640
N-Channel Enhancement
Mode POWER MOSFET
P b
Lead(Pb)-Free
DRAIN CURRENT
3
DRAIN
18 AMPERES
DRAIN SOURCE VOLTAGE
200 VOLTAGE
1 GATE
Features:
*Super High Dense Cell Design For Low R
DS(ON)
R
DS(ON)
<0.18Ω@V
GS
=10V
*
*
*
*
*
Single Pulse Avalanche Energy Rated
SOA is Power Dissipation Limited
Nanosecond Switching Speed
Linear Transfer Characteristics
High Input Impedance
2
SOURCE
1
2
3
1. GATE
2. DRAIN
3. SOURCE
TO-220AB
Maximum Ratings
(T
a
=25 C Unless Otherwise Specified)
Rating
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, (V
GS
@10V, T
C
=25˚C)
, (V
GS
@10V, T
C
=100˚C)
Pulsed Drain Current
Total Power Dissipation(T
C
=25˚C)
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Operating Junction Temperature Range
Storage Temperature Range
Symbol
V
DS
V
GS
I
D
I
DM
P
D
R
θJC
R
θJA
TJ
Tstg
Value
200
±20
18
11
72
125
1
62
+150
- 55~+150
W
˚C/W
˚C/W
˚C
˚C
Unit
V
A
WEITRON
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04-Nov-08
IRF640
Electrical Characteristics
(T
A
= 25℃
Characteristic
Unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
I
D
=250µA,V
GS
=0
Gate-Source Threshold Voltage
I
D
=250µA,V
DS
=V
GS
Gate-Source Leakage current
V
GS
=±20V
Drain-SourceLeakage Current(Tj=25˚C)
V
DS
=200V,V
GS
=0
Drain-SourceLeakage Current(Tj=125˚C)
V
DS
=160V,V
GS
=0
Static Drain-Source On-Resistance
I
D
=11A,V
GS
=10V
Forward Transconductance
I
D
=11A,V
DS
=50V
Forward On Voltage
I
S
=18A, V
GS
=0V,Tj=25˚C
BV
DSS
V
GS(Th)
I
GSS
200
2.0
-
-
I
DSS
-
R
DS(on)
-
-
-
250
0.18
Ω
-
-
-
-
-
V
4.0
±100
25
μA
nA
gfs
V
SD
6.7
-
-
-
-
2.0
S
V
Dynamic
Input Capacitance
V
GS
=0V,V
DS
=25V,f=1.0MHz
Output Capacitance
V
GS
=0V,V
DS
=25V,f=1.0MHz
Reverse Transfer Capacitance
V
GS
=0V,V
DS
=25V,f=1.0MHz
C
iss
C
oss
C
rss
-
-
-
1300
430
130
-
-
-
pF
Switching
Turn-on Delay Time
I
D
=18A, V
DD
=100V,R
GS
=9.1 ,R
L
=5.4
Rise Time
I
D
=18A, V
DD
=100V,R
GS
=9.1Ω,R
L
=5.4Ω
Turn-off Delay Time
I
D
=18A, V
DD
=100V,R
GS
=9.1Ω,R
L
=5.4Ω
T
d(on)
T
r
T
d(off)
-
-
-
-
-
-
21
77
68
ns
WEITRON
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04-Nov-08