Preliminary
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Features
■
Designed for Fast Speed Wireless Switch
Applications
■
Very Low Profile, 0.3 mm
■
Low Inductance (0.25 nH)
■
Designed for High Volume Wireless
Applications, Modules, VCOs
■
Supplied in Punched Paper Carrier Tape
Description
The SMP1340-050 chip scale packaged, surface
mountable PIN diode is designed for high volume switch
applications from 10 MHz to beyond 5 GHz. The
SMP1340-050 has a short carrier lifetime of typically
100 nS, resulting in a fast speed RF switching PIN diode.
The RF performance of the SMP1340-050 is assured by
virtue of its low capacitance (0.3 pF) and low resistance
(1.0
Ω
at 10 mA). The SMP1353-050 chip scale
packaged, surface mountable, low capacitance (0.3 pF)
silicon PIN diode is designed for large signal switch
applications from 15 MHz to beyond 5 GHz. These diodes
have a reverse voltage rating of 100 V and are designed
for use in low distortion switches that are required to hold
off large RF voltages. The typical 1.5
µS
carrier lifetime,
results in a PIN diode with low forward resistance and low
distortion characteristics.
Absolute Maximum Ratings
Characteristic
Reverse Voltage (V
R
)
Power Dissipation @ 25°C Lead
Temperature (P
D
)
Storage Temperature (T
ST
)
Operating Temperature (T
OP
)
Value
50 V
250 mW
-65°C to +150°C
-65°C to +150°C
Electrical Specifications at 25°C
Part
Number
Minimum
Breakdown
Voltage
I
R
= 10
µ
A
(V)
50
100
Maximum Total
Capacitance
V
R
= 20 V
f = 1 MHz
(pF)
0.3
0.3
Typical Forward
Voltage
@ IF = 10 mA
(mV)
880
825
Maximum Series
Resistance
IF = 1 mA
f = 100 MHz
Ω
(Ω)
2.5
15
Maximum Series
Resistance
IF = 10 mA
f = 100 MHz
Ω
(Ω)
1.2
2.8
Typical Carrier
Lifetime
IF = 10 mA
(nsec)
100
1000
SMP1340-050
SMP1353-050
Skyworks Solutions, Inc.
[781] 376-3000
•
Fax
[781] 376-3100
•
Email
sales@skyworksinc.com
•
www.skyworksinc.com
Specifications subject to change without notice. 3/03A
1
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Label
0
54
00
17
30
Y.
ES
A
C
QT
RI
V.
V.
S T
RE
RE
Paper Tape Dimensions
P
1
P
0
D
0
P
2
E
1
F W
Cover Tape
W
1
D
1
T
1
(Cover Tape Thickness)
K
0
B
0
5˚ MAX.
DU
00
-0
I N
94
A
7-9 LTI 903 140
P H
30 M U E -9 38- _
A L
M P 1 ER - O D - 13 _ _ _ _ _
S AF C /N _ _
W ATE T. P _ _ T _
N
E
D U S AL E S
I O
IV
1
C ISU L T
UT
SIT
43
N S
V EE
C A
SE ICE .A.
P
IC V .S
AT DE IN U
ST
DE
A
M
Reel
T (Carrier Tape Thickness)
Carrier Tape
A
0
8˚ MAX.
Description
Cavity
Length
Width
Depth
Pitch
Bottom Hole
Diameter
Perforation
Diameter
Pitch
Position
Carrier Tape
Width
Thickness
Cover Tape
Width
Tape
Thickness
Distance
Cavity to
Perforation
(Width Direction)
Cavity to
Perforation
(Length Direction)
Note: All dimensions are in mm.
Sym.
A
0
B
0
K
0
P
1
D
1
Chip Scale
0.65±0.05
0.76±0.05
0.53±0.05
2.00±0.10
N/A
Chip Scale (-050)
CATHODE INDICATOR
User Direction of Feed
D
0
P
0
E
1
W
T
W
1
T
1
1.50±0.10
4.00±0.10
1.75±0.10
8.00±0.20
0.43±0.05
5.40±0.10
0.062±0.01
4X 0.002
(0.051 mm)
4X 0.008
(0.203 mm)
Standard Reel Size
Standard Reel Quantity
7"
12,000
-050
4X 0.004
(0.102 mm)
4X 0.002
(0.051 mm)
0.011
(0.280 mm)
0.0209
(0.530 mm)
± 0.0228
(0.580 mm)
F
3.50±0.05
P
2
1.00±0.025
0.0264 (0.670 mm)
± 0.0283 (0.720 mm)
0.020
(0.508 mm)
0.012
(0.305 mm)
0.0025
(0.063 mm)
0.0030
(0.076 mm)
2
Skyworks Solutions, Inc.
[781] 376-3000
•
Fax
[781] 376-3100
•
Email
sales@skyworksinc.com
•
www.skyworksinc.com
Specifications subject to change without notice. 3/03A
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Land Pattern
The recommended surface mount pad pattern ensures
quality solder joint formation and high-yielding assembly,
while using minimum board space. The dimensions apply
to both Solder Mask Defined (SMD) as well as Non-Solder
Mask Defined (NSMD) pads. However, NSMD pads, in
which the solder mask is pulled back from the metal pad,
are preferred. This type of pad definition generally
produces improved solder joint reliability as well as an
increased gap under the component. The increased gap
is desirable for enhanced cleaning of flux residue and
component underfill for applications in which the
component will be encapsulated.
375
µm
The solder deposit should be centered on the land pattern
as shown.
100
µm
50
µm
Component Placement
The CSP can easily be picked and placed on most
placement systems. Care should be taken to select a pick
nozzle that matches the component footprint. Vision
alignment after pick can be done to the package edges or
the package leads, depending on the ability of the individual
placement machine. The component should be placed as
centered as possible to the pad and print patterns to assure
even wetting and an absence of tilt or skew.
2.00 mm
600
µm
250
µm
Solder Printing
The recommended land pattern, when used in
conjunction with the following solder deposit
recommendation, provides quality solder joint formation
and high yielding assembly. Solder should be deposited
with a stencil of foil thickness from 100–125
µm,
and
preferably have apertures that are laser-etched and
electro-polished for optimal paste release. The chip scale
package is compatible with most lead-based and lead-free
solder pastes, though a type 3 or type 4 paste is preferred
for the fine aperture printing.
250
µm
2.30 mm
0.70 mm
400
µm
0.45 mm
350
µm
Skyworks Solutions, Inc.
[781] 376-3000
•
Fax
[781] 376-3100
•
Email
sales@skyworksinc.com
•
www.skyworksinc.com
Specifications subject to change without notice. 3/03A
3
Switching Chip Scale PIN Diodes
SMP1340-050, SMP1353-050
Solder Reflow
Solder reflow is best suited to convection or IR reflow
systems, though convection reflow will always give more
rapid and uniform thermal transfer. The CSP can be
successfully reflowed in either air or nitrogen
atmospheres. The solder paste manufacturer’s
recommended reflow profile should be adhered to and
care should be taken to ensure that the profile is adjusted
for variability in thermal mass amongst components.
Attached are generic profiles for eutectic tin-lead solder
and a typical lead-free solder.
These should only be used as a guideline, with the paste
manufacturers recommended profile taking precedence.
A standard solvent flux clean can be safely employed to
remove flux residue from the device edges.
300
270
240
210
Finished Product
Once reflowed, the component should be fairly centered
on the land pattern. Solder should wet evenly to CSP leads
and the component should not display excessive tilt or skew.
A solvent flux clean can be safely employed if desired.
Temp (˚C)
180
150
120
90
60
30
0
0
50
100
150
200
250
300
Time (s)
Lead Free Profile
240
210
180
Temp (˚C)
150
120
90
60
30
0
0
50
100
150
200
250
300
Time (s)
Eutectic Tin-Lead Profile
4
Skyworks Solutions, Inc.
[781] 376-3000
•
Fax
[781] 376-3100
•
Email
sales@skyworksinc.com
•
www.skyworksinc.com
Specifications subject to change without notice. 3/03A
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
