CY7C1021CV26
1-Mbit (64 K × 16) Static RAM
1-Mbit (64 K × 16) Static RAM
Features
■
automatic power-down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable (CE)
and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is
LOW, then data from I/O pins (I/O
0
through I/O
7
), is written into
the location specified on the address pins (A
0
through A
15
). If
Byte High Enable (BHE) is LOW, then data from I/O pins (I/O
8
through I/O
15
) is written into the location specified on the address
pins (A
0
through A
15
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O
0
to I/O
7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O
8
to I/O
15
. See the truth table
at the end of this data sheet for a complete description of Read
and Write modes.
The input/output pins (I/O
0
through I/O
15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a Write operation (CE
LOW, and WE LOW).
Temperature Range
❐
Automotive: –40 °C to 125 °C
High speed
❐
t
AA
= 15 ns
Optimized voltage range: 2.5 V to 2.7 V
Low active power: 220 mW (Max)
Automatic power-down when deselected
Independent control of upper and lower bits
CMOS for optimum speed/power
Available in Pb-free and non Pb-free 44-pin TSOP II, 44-pin
(400-Mil) Molded SOJ and Pb-free 48-ball FBGA packages
■
■
■
■
■
■
■
Functional Description
The CY7C1021CV26 is a high-performance CMOS static RAM
organized as 65,536 words by 16 bits. This device has an
Logic Block Diagram
DATA IN DRIVERS
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
ROW DECODER
64 K × 16
RAM Array
SENSE AMPS
I/O
0
–I/O
7
I/O
8
–I/O
15
COLUMN DECODER
BHE
WE
CE
OE
BLE
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
Cypress Semiconductor Corporation
Document Number: 38-05589 Rev. *F
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised June 20, 2011
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CY7C1021CV26
Contents
Selection Guide ................................................................ 3
Pin Configuration ............................................................. 3
Pin Definitions .................................................................. 4
Maximum Ratings ............................................................. 5
Operating Range ............................................................... 5
Electrical Characteristics ................................................. 5
Capacitance ...................................................................... 5
Thermal Resistance .......................................................... 5
AC Test Loads and Waveforms ....................................... 6
Switching Characteristics ................................................ 6
Switching Waveforms ...................................................... 8
Truth Table ...................................................................... 10
Ordering Information ...................................................... 11
Ordering Code Definitions ......................................... 11
Package Diagrams .......................................................... 12
Acronyms ........................................................................ 14
Document Conventions ................................................. 14
Units of Measure ....................................................... 14
Document History Page ................................................. 15
Sales, Solutions, and Legal Information ...................... 16
Worldwide Sales and Design Support ....................... 16
Products .................................................................... 16
PSoC Solutions ......................................................... 16
Document Number: 38-05589 Rev. *F
Page 2 of 16
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CY7C1021CV26
Selection Guide
Description
[1]
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
-15
15
80
10
Unit
ns
mA
mA
Pin Configuration
Figure 1. 44-pin SOJ/TSOP II
[2]
Figure 2. 48-ball FBGA Pinout
[2]
A
4
A
3
A
2
A
1
A
0
CE
I/O
0
I/O
1
I/O
2
I/O
3
V
CC
V
SS
I/O
4
I/O
5
I/O
6
I/O
7
WE
A
15
A
14
A
13
A
12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
BHE
BLE
I/O
15
I/O
14
I/O
13
I/O
12
V
SS
V
CC
I/O
11
I/O
10
I/O
9
I/O
8
NC
A
8
A
9
A
10
A
11
NC
1
BLE
I/O
8
I/O
9
2
OE
BHE
I/O
10
3
A
0
A
3
A
5
NC
NC
4
A
1
A
4
A
6
A
7
NC
A
15
A
13
A
10
5
A
2
CE
I/O
2
I/O
3
I/O
4
I/O
5
WE
A
11
6
NC
I/O
0
I/O
1
V
CC
V
SS
I/O
6
I/O
7
NC
A
B
C
D
E
F
G
H
V
SS
I/O
11
V
CC
I/O
12
I/O
14
I/O
13
A
14
I/O
15
NC
NC
A
8
A
12
A
9
Notes
1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25 °C.
2. NC pins are not connected on the die.
Document Number: 38-05589 Rev. *F
Page 3 of 16
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CY7C1021CV26
Pin Definitions
Pin Name
A
0
–A
15
I/O
0
–I/O
15
NC
WE
CE
BHE, BLE
OE
Pin Number
1–5, 18–21,
24–27, 42–44
7–10, 13–16,
29–32, 35–38
22, 23, 28
17
6
40, 39
41
I/O Type
Input
Input/Output
No Connect
Input/Control
Input/Control
Input/Control
Input/Control
Description
Address Inputs used to select one of the address locations.
Bidirectional Data I/O lines.
Used as input or output lines depending on operation.
No Connects.
This pin is not connected to the die.
Write Enable Input, active LOW.
When selected LOW, a Write is conducted. When
selected HIGH, a Read is conducted.
Chip Enable Input, active LOW.
When LOW, selects the chip. When HIGH, deselects
the chip.
Byte Write Select Inputs, active LOW.
BHE controls I/O
15
–I/O
8
, BLE controls
I/O
7
–I/O
0
.
Output Enable, active LOW.
Controls the direction of the I/O pins. When LOW, the
I/O pins are allowed to behave as outputs. When de-asserted HIGH, I/O pins are
tri-stated, and act as input data pins.
Ground for the device.
Should be connected to ground of the system.
Power Supply inputs to the device.
V
SS
V
CC
12, 34
11, 33
Ground
Power Supply
Document Number: 38-05589 Rev. *F
Page 4 of 16
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CY7C1021CV26
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65
C
to +150
C
Ambient temperature with
power applied .......................................... –55
C
to +125
C
Supply voltage on
V
CC
to relative GND
[3]
.................................–0.5 V to +4.6 V
DC voltage applied to outputs
in high Z state
[3]
.................................. –0.5 V to V
CC
+ 0.5 V
DC input voltage
[3]
.............................. –0.5 V to V
CC
+ 0.5 V
Current into outputs (LOW) ........................................ 20 mA
Static discharge voltage .......................................... > 2001 V
(per MIL-STD-883, method 3015)
Latch-up current .................................................... > 200 mA
Operating Range
Range
Automotive
Ambient Temperature
–40
C
to +125
C
V
CC
2.5 V–2.7 V
Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
I
SB1
I
SB2
Description
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
[3]
Input leakage current
Output leakage current
V
CC
operating supply current
Automatic CE power-down
Current —TTL inputs
Automatic CE power-down
Current —CMOS inputs
GND < V
I
< V
CC
GND < V
I
< V
CC
, output disabled
V
CC
= Max, I
OUT
= 0 mA, f = f
MAX
= 1/t
RC
Max V
CC
, CE > V
IH
, V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
Max V
CC
, CE > V
CC
– 0.3 V, V
IN
> V
CC
– 0.3 V,
or V
IN
< 0.3 V, f = 0
Test Conditions
V
CC
= Min, I
OH
= –1.0 mA
V
CC
= Min, I
OL
= 1.0 mA
-15
Min
2.3
–
2.0
–0.3
–3
–3
–
–
–
Max
–
0.4
V
CC
+ 0.3
0.8
+3
+3
80
15
10
Unit
V
V
V
V
A
A
mA
mA
mA
Capacitance
Parameter
[4]
C
IN
C
OUT
Description
Input capacitance
Output capacitance
Test Conditions
T
A
= 25
C,
f = 1 MHz, V
CC
= 2.6 V
Max
8
8
Unit
pF
pF
Thermal Resistance
Parameter
[4]
JA
JC
Description
Thermal Resistance (Junction to Ambient)
Thermal Resistance (Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch, four-layer
printed circuit board
44-pin TSOP II Unit
76.92
15.86
C/W
C/W
Notes
3. V
IL
(min.) = –2.0V and V
IH
(max) = V
CC
+ 0.5 V for pulse durations of less than 20 ns.
4. Tested initially and after any design or process changes that may affect these parameters.
Document Number: 38-05589 Rev. *F
Page 5 of 16
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