Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, PDSO24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 11.4 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74AC11623D | 74AC11623N | 74ACT11623N | 74ACT11623D | |
|---|---|---|---|---|
| 描述 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, PDSO24 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, PDIP24 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, PDIP24 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, PDSO24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP |
| 封装等效代码 | SOP24,.4 | DIP24,.3 | DIP24,.3 | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 电源 | 3.3/5 V | 3.3/5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 11.4 ns | 11.4 ns | 9.1 ns | 9.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 包装说明 | - | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 |
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