8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 54 |
最大工作温度 | 85 Cel |
最小工作温度 | -40 Cel |
最大供电/工作电压 | 3.6 V |
最小供电/工作电压 | 3 V |
额定供电电压 | 3.3 V |
最小存取时间 | 6 ns |
加工封装描述 | 0.400 × 0.875 INCH, 0.80 MM PITCH, TSOP2-54 |
状态 | DISCONTINUED |
工艺 | CMOS |
包装形状 | 矩形的 |
包装尺寸 | SMALL OUTLINE, THIN PROFILE |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 0.8000 mm |
端子涂层 | 锡 铅 |
端子位置 | 双 |
包装材料 | 塑料/环氧树脂 |
温度等级 | INDUSTRIAL |
内存宽度 | 16 |
组织 | 8M × 16 |
存储密度 | 1.34E8 deg |
操作模式 | 同步 |
位数 | 8.39E6 words |
位数 | 8M |
存取方式 | 四 BANK PAGE BURST |
内存IC类型 | 同步动态随机存取存储器 |
端口数 | 1 |
K4S281632C | K4S281632C-TI | K4S281632C-TI1H | K4S281632C-TI1L | K4S281632C-TI75 | K4S281632C-TP | K4S281632C-TP1H | K4S281632C-TP1L | K4S281632C-TP75 | |
---|---|---|---|---|---|---|---|---|---|
描述 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 | 8M X 16 SYNCHRONOUS DRAM, 6 ns, PDSO54 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
表面贴装 | Yes | Yes | YES | YES | YES | Yes | YES | YES | YES |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | 双 | 双 | DUAL | DUAL | DUAL | 双 | DUAL | DUAL | DUAL |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
组织 | 8M × 16 | 8M × 16 | 8MX16 | 8MX16 | 8MX16 | 8M × 16 | 8MX16 | 8MX16 | 8MX16 |
是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
零件包装代码 | - | - | TSOP2 | TSOP2 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 |
包装说明 | - | - | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | - | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 |
针数 | - | - | 54 | 54 | 54 | - | 54 | 54 | 54 |
Reach Compliance Code | - | - | unknow | unknow | unknow | - | unknow | unknow | unknow |
ECCN代码 | - | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
Is Samacsys | - | - | N | N | N | - | N | N | N |
访问模式 | - | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | - | - | 6 ns | 6 ns | 5.4 ns | - | 6 ns | 6 ns | 5.4 ns |
其他特性 | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | - | - | 100 MHz | 100 MHz | 133 MHz | - | 100 MHz | 100 MHz | 133 MHz |
I/O 类型 | - | - | COMMON | COMMON | COMMON | - | COMMON | COMMON | COMMON |
交错的突发长度 | - | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
JESD-30 代码 | - | - | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 | - | R-PDSO-G54 | R-PDSO-G54 | R-PDSO-G54 |
JESD-609代码 | - | - | e0 | e0 | e0 | - | e0 | e0 | e0 |
长度 | - | - | 22.22 mm | 22.22 mm | 22.22 mm | - | 22.22 mm | 22.22 mm | 22.22 mm |
内存密度 | - | - | 134217728 bi | 134217728 bi | 134217728 bi | - | 134217728 bi | 134217728 bi | 134217728 bi |
内存集成电路类型 | - | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
端口数量 | - | - | 1 | 1 | 1 | - | 1 | 1 | 1 |
字数 | - | - | 8388608 words | 8388608 words | 8388608 words | - | 8388608 words | 8388608 words | 8388608 words |
字数代码 | - | - | 8000000 | 8000000 | 8000000 | - | 8000000 | 8000000 | 8000000 |
工作模式 | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | TSOP2 | TSOP2 | TSOP2 | - | TSOP2 | TSOP2 | TSOP2 |
封装等效代码 | - | - | TSOP54,.46,32 | TSOP54,.46,32 | TSOP54,.46,32 | - | TSOP54,.46,32 | TSOP54,.46,32 | TSOP54,.46,32 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | - | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | - | - | 4096 | 4096 | 4096 | - | 4096 | 4096 | 4096 |
座面最大高度 | - | - | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | - | - | YES | YES | YES | - | YES | YES | YES |
连续突发长度 | - | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
最大待机电流 | - | - | 0.001 A | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | - | - | 0.21 mA | 0.21 mA | 0.22 mA | - | 0.21 mA | 0.21 mA | 0.22 mA |
最大供电电压 (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
技术 | - | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | - | - | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | - | 10.16 mm | 10.16 mm | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm |
Base Number Matches | - | - | 1 | 1 | 1 | - | 1 | 1 | 1 |
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