Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Thin Film Technology Corp (TFT) |
| 包装说明 | BGA, |
| Reach Compliance Code | unknown |
| 系列 | HE2LA |
| JESD-30 代码 | R-PBGA-B8 |
| JESD-609代码 | e1 |
| 长度 | 10.16 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出阻抗标称值（Z0） | 100 Ω |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 可编程延迟线 | NO |
| 座面最大高度 | 1.0922 mm |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总延迟标称（td） | 0.6 ns |
| 宽度 | 6.35 mm |
| Base Number Matches | 1 |
| HE2LABA060DT1-C | HE2LABA050D-C | HE2LABA040DT1-C | HE2LABA050DT1-C | HE2LABA080D-C | HE2LABA100DT1-C | HE2LABA070DT1-C | HE2LABA070D-C | HE2LABA080DT1-C | HE2LAAA050DT1 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 | Active Delay Line, 1-Func, PBGA6, BGA-6 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA-6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA | HE2LA |
| JESD-30 代码 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B8 | R-PBGA-B6 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e0 |
| 长度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 6.35 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 6 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出阻抗标称值（Z0） | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω | 100 Ω |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm | 1.0922 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总延迟标称（td） | 0.6 ns | 0.5 ns | 0.4 ns | 0.5 ns | 0.8 ns | 1 ns | 0.7 ns | 0.7 ns | 0.8 ns | 0.5 ns |
| 宽度 | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 3.81 mm |
| 厂商名称 | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | Thin Film Technology Corp (TFT) | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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