Memory IC
| 参数名称 | 属性值 |
| 厂商名称 | Catalyst |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| Base Number Matches | 1 |
| CAT33C116S-TE13 | CAT33C116K | CAT33C116K-TE13 | CAT33C116S | CAT33C116SI | CAT33C116SI-TE13 | CAT33C116KI | CAT33C116KI-TE13 | CAT33C116P | CAT33C116PI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Memory IC | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.210 INCH, EIAJ, SOIC-8 | Memory IC | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | Memory IC | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.210 INCH, EIAJ, SOIC-8 | Memory IC | EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| 包装说明 | , | SOP, SOP8,.3 | , | SOP, SOP8,.25 | SOP, SOP8,.25 | , | SOP, SOP8,.3 | , | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| 厂商名称 | Catalyst | - | - | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
| 是否无铅 | - | 含铅 | - | 含铅 | 含铅 | - | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | - | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 零件包装代码 | - | SOIC | - | SOIC | SOIC | - | SOIC | - | DIP | DIP |
| 针数 | - | 8 | - | 8 | 8 | - | 8 | - | 8 | 8 |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | - | EAR99 | - | EAR99 | EAR99 |
| 其他特性 | - | 3 WIRE INTERFACE | - | 3 WIRE INTERFACE | 3 WIRE INTERFACE | - | 3 WIRE INTERFACE | - | 3 WIRE INTERFACE | 3 WIRE INTERFACE |
| 备用内存宽度 | - | 16 | - | 16 | 16 | - | 16 | - | 16 | 16 |
| 最大时钟频率 (fCLK) | - | 1 MHz | - | 1 MHz | 1 MHz | - | 1 MHz | - | 1 MHz | 1 MHz |
| 数据保留时间-最小值 | - | 100 | - | 10 | 100 | - | 100 | - | 100 | 100 |
| JESD-30 代码 | - | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | - | R-PDIP-T8 | R-PDIP-T8 |
| JESD-609代码 | - | e0 | - | e0 | e0 | - | e0 | - | e0 | e0 |
| 长度 | - | 5.3 mm | - | 4.9 mm | 4.9 mm | - | 5.3 mm | - | 9.27 mm | 9.27 mm |
| 内存密度 | - | 16384 bit | - | 16384 bit | 16384 bit | - | 16384 bit | - | 16384 bi | 16384 bi |
| 内存集成电路类型 | - | EEPROM | - | EEPROM | EEPROM | - | EEPROM | - | EEPROM | EEPROM |
| 内存宽度 | - | 8 | - | 8 | 8 | - | 8 | - | 8 | 8 |
| 功能数量 | - | 1 | - | 1 | 1 | - | 1 | - | 1 | 1 |
| 端子数量 | - | 8 | - | 8 | 8 | - | 8 | - | 8 | 8 |
| 字数 | - | 2048 words | - | 2048 words | 2048 words | - | 2048 words | - | 2048 words | 2048 words |
| 字数代码 | - | 2000 | - | 2000 | 2000 | - | 2000 | - | 2000 | 2000 |
| 工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | - | 70 °C | 85 °C | - | 85 °C | - | 70 °C | 85 °C |
| 组织 | - | 2KX8 | - | 2KX8 | 2KX8 | - | 2KX8 | - | 2KX8 | 2KX8 |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | - | SOP | SOP | - | SOP | - | DIP | DIP |
| 封装等效代码 | - | SOP8,.3 | - | SOP8,.25 | SOP8,.25 | - | SOP8,.3 | - | DIP8,.3 | DIP8,.3 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | - | IN-LINE | IN-LINE |
| 并行/串行 | - | SERIAL | - | SERIAL | SERIAL | - | SERIAL | - | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 3 V | - | 3 V | 3 V | - | 3 V | - | 3 V | 3 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2.03 mm | - | 1.75 mm | 1.75 mm | - | 2.03 mm | - | 4.57 mm | 4.57 mm |
| 串行总线类型 | - | 3-WIRE | - | 3-WIRE | 3-WIRE | - | 3-WIRE | - | 3-WIRE | 3-WIRE |
| 最大待机电流 | - | 0.00001 A | - | 0.00001 A | 0.00001 A | - | 0.00001 A | - | 0.00001 A | 0.00001 A |
| 最大压摆率 | - | 0.002 mA | - | 0.002 mA | 0.003 mA | - | 0.003 mA | - | 0.002 mA | 0.003 mA |
| 最大供电电压 (Vsup) | - | 3.3 V | - | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | - | 2.7 V | - | 2.7 V | 2.7 V | - | 2.7 V | - | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | 3 V | - | 3 V | 3 V | - | 3 V | - | 3 V | 3 V |
| 表面贴装 | - | YES | - | YES | YES | - | YES | - | NO | NO |
| 技术 | - | CMOS | - | CMOS | CMOS | - | CMOS | - | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | - | GULL WING | GULL WING | - | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | - | 1.27 mm | 1.27 mm | - | 1.27 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | - | DUAL | DUAL | - | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 5.25 mm | - | 3.9 mm | 3.9 mm | - | 5.25 mm | - | 7.62 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | - | 5 ms | - | 5 ms | 5 ms | - | 5 ms | - | 5 ms | 5 ms |
| 写保护 | - | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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