SH Series Overview
SuperH RISC Engine Embedded Processors
TM
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Table of Contents
Section 1 Introduction Challenges of
Next-Generation Applications ..........................................................1
1.1 Demands on Microprocessors........................................................................................... 3
1.2 Hitachi's SH Series Rises to the Challenge of Next-Generation Applications .......................... 5
1.2.1 Low Power Dissipation ....................................................................................... 6
1.2.2 High Integration.................................................................................................. 6
Section 2 SH Series Family Architecture..........................................................9
2.1 Common Features ............................................................................................................ 9
2.1.1 Register Set ........................................................................................................ 11
2.1.2 Addressing Modes ................................................................................................ 14
2.1.3 Instruction Set....................................................................................................... 16
2.2 SH-1's Implementation of the Architecture....................................................................... 19
2.3 SH-2 Implementation -- Additions to the Architecture ..................................................... 19
2.4 SH-3 Implementation--Additions to the Architecture ....................................................... 22
2.4.1 Memory Management in the SH-3 ......................................................................... 23
2.4.2 Additional Instructions in the SH-3......................................................................... 25
Section 3 Handling Exceptions Vector -- Table Organization ...........................27
Section 4 Power-Down Modes -- CPU Operating States.......................................31
Section 5 External Memory Control -- Buses.......................................................33
Section 6 Peripherals..........................................................................................35
6.1 Common Features.............................................................................................................. 35
6.2 Peripherals and Memory on the SH-1 Devices...................................................................... 37
6.3 Peripherals on the SH-2 family............................................................................................ 39
6.4 Peripherals on the SH-3 family............................................................................................ 40
Section 7 Device Summary and Packaging..........................................................43
Section 8 Support Tools.....................................................................................47
8.1 Hitachi Tools..................................................................................................................... 47
8.2 Third-party Vendors........................................................................................................... 51
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Section 1 Introduction Challenges of Next-Generation
Applications
Recent years have seen major advances in the capabilities of consumer electronics. These
next-generation applications are typified by Personal Digital Assistants (PDAs),
multimedia/entertainment systems and wireless communications devices. These emerging
markets and applications represent an opportunity for unprecedented growth. At the same time,
established markets and products, such as automotive and industrial applications or computer
peripherals such as hard disk drives and telecommunications adapters, are briskly moving toward
increased performance.
Consumers continue to expect more features, more capacity and higher communication rates.
User interfaces with advanced features, such as handwriting and voice recognition, are becoming
common expectations in advanced PDAs. Video games and multimedia applications demand
higher resolution images, faster image-rendering, image-compression and image-decompression
rates and higher sampling rates for synthetic audio. I order to provide higher data rates,
reliability and security, communications devices must utilize complex coding and signal
processing techniques. Increasing disk capacity demands higher areal density with faster an
more-precise head-position-control loops.
These end-product needs place a common requirement upon the system design--greater processing
power from the microprocessors and microcontrollers.
End-user expectations in these markets do not end with increased performance, however. At the
same time, these products are expected to offer portability and low cost. Portability demands
both compactness and battery operation. In turn, compactness demands high integration and
high-density packaging; similarly, acceptable operating time on realistically-sized batteries
requires low power utilization.
Historically, products were optimized for one parameter--performance, size or power. Often,
optimization consisted of maximizing one parameter at the essentially unrestrained expense of
the others. For example, engineering workstations are optimized for computational performance;
within wide limits, physical size and power consumption of desktop machines are distant
secondary considerations. For next-generation applications, however, all three parameters are
squeezed simultaneously. While it is, of course, not possible optimize all parameters in any one
design, an application-specific figure of merit, requiring suitably high marks in all three areas,
must somehow be achieved.
Finally, the dynamics of these consumer markets dictate short product lifetimes. As a result,
OEMs must get their products to the market expeditiously. It has been demonstrated that late
entry into the market has a more significant negative impact on a product's bottom line than, for
example, increased costs for development, manufacturing or marketing. Short product lifetimes
and timely introduction require rapid product development.
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