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HYMR13216H-653

产品描述Rambus DRAM Module, 32MX16, CMOS, RIMM-184
产品类别存储    存储   
文件大小205KB,共17页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
下载文档 详细参数 全文预览

HYMR13216H-653概述

Rambus DRAM Module, 32MX16, CMOS, RIMM-184

HYMR13216H-653规格参数

参数名称属性值
厂商名称SK Hynix(海力士)
零件包装代码DMA
包装说明,
针数184
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式BLOCK ORIENTED PROTOCOL
其他特性SELF CONTAINED REFRESH
JESD-30 代码R-XDMA-N184
内存密度536870912 bit
内存集成电路类型RAMBUS DRAM MODULE
内存宽度16
功能数量1
端口数量1
端子数量184
字数33554432 words
字数代码32000000
工作模式SYNCHRONOUS
组织32MX16
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
自我刷新YES
最大供电电压 (Vsup)2.63 V
最小供电电压 (Vsup)2.37 V
标称供电电压 (Vsup)2.5 V
表面贴装NO
技术CMOS
端子形式NO LEAD
端子位置DUAL
Base Number Matches1

文档预览

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Direct Rambus RIMM
with 128/144Mbit RDRAMs
Preliminary
Overview
The Rambus
®
RIMM
TM
module is a general purpose high-
performance memory subsystem suitable for use in a broad
range of applications including computer memory, personal
computers, workstations, and other applications where high
bandwidth and low latency are required.
The Rambus RIMM module consist of 128Mb/144Mb
Direct Rambus DRAM devices. These are extremely high-
speed CMOS DRAMs organized as 8M words by 16 or 18
bits. The use of Rambus Signaling Level (RSL) technology
permits 600MHz ,711MHz or 800MHz transfer rates while
using conventional system and board design technologies.
Direct RDRAM devices are capable of sustained data
transfers at 1.25 ns per two bytes (10ns per 16 bytes).
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous randomly addressed
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The Direct RDRAM's 16-banks architecture
supports up to four simultaneous transactions per device.
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available from RIMM modules. An optional -LP designator
is used to indicate low power modules.
Table 1: RIMM Module Frequency and Latency
Organization
x16
x16
x16
x16
x18
x18
x18
x18
I/O Freq.
MHz
600
711
800
800
600
711
800
800
t rac (Row Access
Time) ns
53
45
45
40
53
45
45
40
Features
w
High speed 800,711 and 600 MHz RDRAM storage
w
184 edge connector pads with 1 mm pad spacing
w
Maximum module PCB size: 133.5mm x 31.75mm x
1.37mm(5.21” x 1.25” x 0.05”)
w
Each RDRAM has 32 banks, for a total of 512, 384, 256,
192 or 128 banks on each 256MB, 192MB, 128MB,
96MB, or 64MB module respectively
w
Gold plated edge connector pad contacts
wSerial
Presence Detect(SPD) support
¾
w
Operates from a 2.5 volt supply (
¡
5%)
w
Low power and powerdown self refresh modes
w
Separate Row and Column buses for higher
efficiency
Form Factor
The Rambus RIMM modules are offered in a 184-pad 1mm
edge connector pad pitch from factor suitable for either 184
or 168 contact RIMM connectors. The RIMM module is
suitable for desktop and other system applications. Figure 1
shows an eight device Rambus RIMM module without heat
spreader.
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0/Dec.99
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