IC LED DISPLAY DRIVER, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Display Driver
参数名称 | 属性值 |
厂商名称 | Toshiba(东芝) |
零件包装代码 | SOIC |
包装说明 | SSOP, |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
数据输入模式 | SERIAL |
显示模式 | SEGMENT |
输入特性 | STANDARD |
接口集成电路类型 | LED DISPLAY DRIVER |
JESD-30 代码 | R-PDSO-G16 |
长度 | 8.2 mm |
复用显示功能 | NO |
功能数量 | 1 |
区段数 | 8 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | OPEN-COLLECTOR |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
认证状态 | Not Qualified |
座面最大高度 | 1.9 mm |
最大压摆率 | 35 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1 mm |
端子位置 | DUAL |
宽度 | 4.6 mm |
最小 fmax | 10 MHz |
Base Number Matches | 1 |
TB62705BF(ER) | TB62705BF(EL) | TB62705BF-TP1 | TB62705BF-TP2 | |
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描述 | IC LED DISPLAY DRIVER, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Display Driver | IC LED DISPLAY DRIVER, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Display Driver | IC LED DISPLAY DRIVER, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Display Driver | IC LED DISPLAY DRIVER, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Display Driver |
厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC |
包装说明 | SSOP, | SSOP, | SSOP, | SSOP, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
数据输入模式 | SERIAL | SERIAL | SERIAL | SERIAL |
显示模式 | SEGMENT | SEGMENT | SEGMENT | SEGMENT |
输入特性 | STANDARD | STANDARD | STANDARD | STANDARD |
接口集成电路类型 | LED DISPLAY DRIVER | LED DISPLAY DRIVER | LED DISPLAY DRIVER | LED DISPLAY DRIVER |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
长度 | 8.2 mm | 8.2 mm | 8.2 mm | 8.2 mm |
复用显示功能 | NO | NO | NO | NO |
功能数量 | 1 | 1 | 1 | 1 |
区段数 | 8 | 8 | 8 | 8 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | SSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm |
最大压摆率 | 35 mA | 35 mA | 35 mA | 35 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 4.6 mm | 4.6 mm | 4.6 mm | 4.6 mm |
最小 fmax | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
Base Number Matches | 1 | 1 | 1 | 1 |
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