SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.915 mm |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.334 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| DP8341N | NS32441V | NS32441VX | DP8341J | DP8341V | DP8341VX | |
|---|---|---|---|---|---|---|
| 描述 | SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24, PLASTIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | QCCJ, | QCCJ, | DIP, | QCCJ, | QCCJ, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-GDIP-T24 | S-PQCC-J28 | S-PQCC-J28 |
| 端子数量 | 24 | 28 | 28 | 24 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | QCCJ | DIP | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.334 mm | 4.57 mm | 4.57 mm | 4.572 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD |
| 宽度 | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm | 11.43 mm | 11.43 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 长度 | 31.915 mm | 11.43 mm | 11.43 mm | - | 11.43 mm | 11.43 mm |
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