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LD549-CHIP

产品描述Audio Amplifier, DIE
产品类别模拟混合信号IC    消费电路   
文件大小80KB,共5页
制造商Gennum ( Semtech )
官网地址http://www.gennum.com
下载文档 详细参数 选型对比 全文预览

LD549-CHIP概述

Audio Amplifier, DIE

LD549-CHIP规格参数

参数名称属性值
厂商名称Gennum ( Semtech )
零件包装代码DIE
包装说明DIE,
针数8
Reach Compliance Codeunknown
ECCN代码EAR99
商用集成电路类型AUDIO AMPLIFIER
JESD-30 代码R-XUUC-N8
端子数量8
封装主体材料UNSPECIFIED
封装代码DIE
封装形状RECTANGULAR
封装形式UNCASED CHIP
认证状态Not Qualified
表面贴装YES
端子形式NO LEAD
端子位置UPPER
Base Number Matches1

文档预览

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High Power Class B
Output Stage
LC549/LV549/LD549 DATA SHEET
FEATURES
40dB of electrical gain
1.0 to 1.6 VDC supply operating range
current trim capability (R
T
)
high efficiency class B output stage
may be used with a linear or compression preamplfier
STANDARD PACKAGING
• 8 pin MICROpac (LC549)
• 8 pin MINIpac
• 8 pin PLID
®
(LC549, LD549)
• Chip (47 x 40 mils) (LC549, LD549)
DESCRIPTION
The LC/LV/LD549 is an 8 pin, low voltage, push-pull audio
frequency output stage amplifier with a single unbalanced
input. The circuit utilizes two internal negative feedback
loops to stabilize the DC operating point for temperature
stability and to linearize the transfer function over a wide
dynamic range. The circuit operates near ideal class B
conditions resulting in low distortion and very low quiescent
current, required for extended battery life.
The LC549, LV549 and LD549 differ in only one respect;
the LV549 and LD549 are selected devices which are
capable of delivering from 10 mA to 41 mA and from 36 mA
to 75 mA of output current respectively. These values are
the maximum current drawn with both output stage transistors
in saturation. Thus the LD549 is capable of producing a
high output in a low impedance load, the LV549 is selected
to have lower peak currents, extending the life of the
battery.
R
T
3
V
B
6
5
OUTPUT 1
INPUT
2
8
OUTPUT 2
4
1
7
GND
DEC 1 DEC 2
U.S. Patent No. 4,085,382
Patented in other countries
BLOCK DIAGRAM
Revision Date: January 2001
Document No. 500 - 25 - 09
GENNUM CORPORATION P.O. Box 489, Stn A, Burlington, Ontario, Canada L7R 3Y3
Japan Branch: A-302 Miyamae Village, 2-10-42 Miyamae, Suginami-ku Tokyo 168, Japan
tel. (905) 632-2996 fax: (905) 632-5946
tel. (03) 3334-7700
fax: (03) 3247-8839

LD549-CHIP相似产品对比

LD549-CHIP LV549-MINI LC549-CHIP LC549-PLID LC549-MINI LC549-MICRO LD549-PLID LD549-MINI
描述 Audio Amplifier, DIE Audio Amplifier, PDFP8, MINIPAK-8 Audio Amplifier, DIE Audio Amplifier, PDSO8, PLID, 8 PIN Audio Amplifier, PDFP8, MINIPAK-8 Audio Amplifier, PDFP8, MICROPAK-8 Audio Amplifier, PDSO8, PLID, 8 PIN Audio Amplifier, PDFP8, MINIPAK-8
零件包装代码 DIE DFP DIE SOIC DFP DFP SOIC DFP
针数 8 8 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 代码 R-XUUC-N8 R-PDFP-F8 R-XUUC-N8 R-PDSO-C8 R-PDFP-F8 R-PDFP-F8 R-PDSO-C8 R-PDFP-F8
端子数量 8 8 8 8 8 8 8 8
封装主体材料 UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 UNCASED CHIP FLATPACK UNCASED CHIP SMALL OUTLINE FLATPACK FLATPACK SMALL OUTLINE FLATPACK
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES YES YES YES
端子形式 NO LEAD FLAT NO LEAD C BEND FLAT FLAT C BEND FLAT
端子位置 UPPER DUAL UPPER DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1 1

 
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