F/FAST SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | IOH = 15MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流（ICC） | 33 mA |
| 传播延迟（tpd） | 7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| SNJ54F37FKR | SN54F37FKR | SNJ54F37FK | SNJ54F37J | |
|---|---|---|---|---|
| 描述 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC | QLCC | QLCC | DIP |
| 包装说明 | QCCN, | QCCN, | QCCN, LCC20,.35SQ | DIP, DIP14,.3 |
| 针数 | 20 | 20 | 20 | 14 |
| Reach Compliance Code | unknown | unknown | not_compliant | not_compliant |
| 其他特性 | IOH = 15MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V | IOH = 15MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V | IOH = 15MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V | IOH = 15MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T14 |
| 长度 | 8.89 mm | 8.89 mm | 8.89 mm | 19.56 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | QCCN | QCCN | DIP |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 最大电源电流（ICC） | 33 mA | 33 mA | 33 mA | 33 mA |
| 传播延迟（tpd） | 7 ns | 7 ns | 7 ns | 7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2.03 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL |
| 宽度 | 8.89 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | - |
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