Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDIP8, PLASTIC, DIP-8
| 参数名称 | 属性值 |
| 厂商名称 | Rhombus Industries, Inc. |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDIP-T8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 6.35 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总延迟标称（td） | 35 ns |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| LVMDM-35 | LVMDM-40G | LVMDM-35J | LVMDM-50 | LVMDM-50J | |
|---|---|---|---|---|---|
| 描述 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDIP8, PLASTIC, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDSO8, LOW PROFILE, SMD-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDSO8, LOW PROFILE, J LEAD, SMD-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDIP8, PLASTIC, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, PDSO8, LOW PROFILE, J LEAD, SMD-8 |
| 厂商名称 | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | SOIC |
| 包装说明 | DIP, | LOW PROFILE, SMD-8 | LOW PROFILE, J LEAD, SMD-8 | PLASTIC, DIP-8 | SOJ, |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-J8 | R-PDIP-T8 | R-PDSO-J8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOJ | DIP | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 可编程延迟线 | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 6.35 mm | 6.35 mm | 6.73 mm | 6.35 mm | 6.73 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | J BEND | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 总延迟标称（td） | 35 ns | 40 ns | 35 ns | 50 ns | 50 ns |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
TI技术论坛
嵌入式系统
嵌入式系统
嵌入式系统
ARM技术
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
