8-Pin SO (derate 23.3mW/°C above +70°C)..........1860.5mW
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ......................................................+150°C
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1)
6-Pin, 3mm x 3mm TDFN..............................................9°C/W
8-Pin SO ........................................................................7°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)
6-Pin, 3mm x 3mm TDFN............................................42°C/W
8-Pin SO ......................................................................43°C/W
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
IN
= 12V, V
EN
= 12V (SO only), C
V5
= 0.1µF to GND, I
V5
= 0, V
DIM
= 4V, V
CS
- = 0V (SO only), connect R
SENSE
= 2Ω (MAX16815)
and R
SENSE
= 1Ω (MAX16828) between CS+ and GND. TA = -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C.) (Note 2)
PARAMETER
Supply Voltage Range
Ground Current
Shutdown Supply Current
Guaranteed Output Current
Output Current Accuracy
SYMBOL
V
IN
I
G
I
SHDN
I
OUT
(Note 3)
I
LOAD
= 100mA
I
LOAD
= 200mA
V
EN
≤ 0.6V (SO only)
R
SENSE
= 2_ (MAX16815)
R
SENSE
= 1_ (MAX16828)
35mA < I
OUT
< 100mA (MAX16815)
35mA < I
OUT
< 200mA (MAX16828)
I
OUT
= 100mA (current pulsed),
12V < V
IN
< 40V (MAX16815) (Note 4)
Dropout Voltage
DVDO
I
OUT
= 100mA (current pulsed),
6.5V < V
IN
< 12V (MAX16815) (Note 4)
I
OUT
= 200mA (current pulsed),
12V < V
IN
< 40V (MAX16828) (Note 5)
I
OUT
= 200mA (current pulsed),
6.5V < V
IN
< 12V (MAX16828) (Note 5)
Output Current Slew Rate
Short-Circuit Current
EN INPUT (SO ONLY)
EN Input Current
EN Input Voltage High
EN Input Voltage Low
I
EN
V
IH
V
IL
-2.5
2.8
0.6
-1
-0.2
µA
V
V
Current rising
Current falling
V
OUT
= 0V, V
IN
= 12V, MAX16815
V
OUT
= 0V, V
IN
= 12V, MAX16828
130
250
100
200
±3.5
±3.5
0.1
0.1
0.27
0.27
9.7
9.7
200
300
270
350
0.4
0.6
V
0.55
0.7
mA/µs
mA
CONDITIONS
MIN
6.5
0.82
1
35
TYP
MAX
40.0
2
2
70
UNITS
V
mA
µA
mA
%
www.maximintegrated.com
Maxim Integrated
│
2
MAX16815/MAX16828
High-Voltage, 100mA/200mA Adjustable Linear
High-Brightness LED Drivers with PWM Dimming
Electrical Characteristics (continued)
(V
IN
= 12V, V
EN
= 12V (SO only), C
V5
= 0.1µF to GND, I
V5
= 0, V
DIM
= 4V, V
CS
- = 0V (SO only), connect R
SENSE
= 2Ω (MAX16815)
and R
SENSE
= 1Ω (MAX16828) between CS+ and GND. TA = -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C.) (Note 2)
PARAMETER
CURRENT SENSE
Regulated R
SENSE
Voltage
CS- Voltage Range
Input Current (CS+)
Input Current (CS-)
DIM Input Current
DIM Input-Voltage High
DIM Input-Voltage Low
Turn-On Time
Turn-Off Time
THERMAL OVERLOAD
Thermal-Shutdown Temperature
Thermal-Shutdown Hysteresis
+5V REGULATOR
Output-Voltage Load Regulation
Output Voltage
V5 Short-Circuit Current
V
V5
DV
V5
(Note 8)
0 < I
V5
< 4mA
V
V5
= 0 (Note 9)
4.8
5.0
12
15
5.2
20
V
mV/mA
mA
+159
24
°C
°C
V
IH
V
IL
t
ON
t
OFF
After V
DIM
rising to 4V (Note 7)
After V
DIM
falling to 0.6V (Note 7)
V
RSNS
V
RSNS
= V
CS+
for TDFN package;
V
RSNS
= V
CS+
- VCS- for SO package
SO only
V
CS+
= 220mV
V
CS+
= 220mV (SO only)
V
DIM
= 0V
-50
-2.5
2.8
0.6
100
55
193
-0.3
2.7
17.2
-1.0
-0.2
200
207
+4.7
7
mV
V
µA
µA
µA
V
V
µs
µs
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Note 2:
All devices are 100% production tested at T
A
= +25°C. Limits over the operating temperature range are guaranteed by
design.
Note 3:
Resistors were added from OUT to CS+ to aid with power dissipation.
Note 4:
Dropout is measured as follows:
Connect R
O
from OUT to CS+. Connect R
SENSE
= 2Ω (MAX16815) from CS+ to GND (for TDFN) or from CS+ to CS- (for
SO). Set V
IN
= 12V (record V
OUT1
= V
OUT
). For V
IN
= 40V, use R
O
= 360Ω; for V
IN
= 6.5V, use R
O
= 56Ω.
Reduce V
IN
until V
OUT
= 0.97 x V
OUT1
(record as V
IN2
and V
OUT2
). DVDO = V
IN2
- V
OUT2
.
Note 5:
Dropout is measured as follows:
Connect R
O
from OUT to CS+. Connect RSENSE = 1Ω (MAX16828) from CS+ to GND (for TDFN) or from CS+ to CS- (for
SO). Set V
IN
= 12V (record V
OUT1
= V
OUT
). For V
IN
= 40V, use R
O
= 180Ω; for V
IN
= 6.5V, use R
O
= 27Ω.
Reduce V
IN
until V
OUT
= 0.97 x V
OUT1
(record as V
IN2
and V
OUT2
). ∆V
DO
= V
IN2
- V
OUT2
.
Note 6:
I
V5
= 0mA.
Note 7:
t
ON
time includes the delay and the rise time needed for I
OUT
to reach 90% of its final value. t
OFF
time is the time needed
for I
OUT
to drop below 10%. See the Typical Operating Characteristics. t
ON
and t
OFF
are tested with 100Ω (MAX16815) or
51Ω (MAX16828) from OUT to CS+.
Note 8:
Current regulation varies with V5 load (see the
Typical Operating Characteristics).
Note 9:
Thermal shutdown does not function if V5 is shorted to ground.
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