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TLV2470, TLV2471
,
TLV2472, TLV2473
TLV2474, TLV2475, TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
www.ti.com
FAMILY OF 600μA/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT
HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
FEATURES
•
•
•
•
CMOS Rail-To-Rail Input/Output
Input Bias Current: 2.5pA
Low Supply Current: 600μA/Channel
Ultra-Low Power Shutdown Mode:
I
DD(SHDN)
: 350nA/ch at 3V
I
DD(SHDN)
: 1000nA/ch at 5V
Gain-Bandwidth Product: 2.8MHz
High Output Drive Capability:
–
±10mA
at 180mV
–
±35mA
at 500mV
Input Offset Voltage: 250μV (typ)
Supply Voltage Range: 2.7V to 6V
Ultra-Small Packaging
– SOT23-5 or -6 (TLV2470/1)
– MSOP-8 or -10 (TLV2472/3)
DESCRIPTION
The TLV247x is a family of CMOS rail-to-rail input/
output operational amplifiers that establishes a new
performance point for supply current versus ac
performance.
These
devices
consume
just
600μA/channel
while
offering
2.8MHz
of
gain-bandwidth product. Along with increased ac
performance, the amplifier provides high output drive
capability, solving a major shortcoming of older
micropower operational amplifiers. The TLV247x can
swing to within 180mV of each supply rail while
driving a 10mA load. For non-RRO applications, the
TLV247x can supply
±35mA
at 500mV off the rail.
Both the inputs and outputs swing rail-to-rail for
increased dynamic range in low-voltage applications.
This performance makes the TLV247x family ideal
for sensor interface, portable medical equipment,
and other data acquisition circuits.
•
•
•
•
•
FAMILY PACKAGE TABLE
DEVICE
TLV2470
TLV2471
TLV2472
TLV2473
TLV2474
TLV2475
NUMBER OF
CHANNELS
1
1
2
2
4
4
PACKAGE TYPES
PDIP
8
8
8
14
14
16
SOIC
8
8
8
14
14
16
SOT23
6
5
—
—
—
—
TSSOP
—
—
—
—
14
16
MSOP
—
—
8
10
—
—
SHUTDOWN
Yes
—
—
Yes
—
Yes
Refer to the EVM Selection
Guide (SLOU060)
UNIVERSAL EVM BOARD
A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS
(1)
DEVICE
TLV247X
TLV245X
TLV246X
TLV277X
(1)
V
DD
(V)
2.7 – 6.0
2.7 – 6.0
2.7 – 6.0
2.5 – 6.0
V
IO
(μV)
250
20
150
360
BW
(MHz)
2.8
0.22
6.4
5.1
SLEW RATE
(V/μs)
1.5
0.11
1.6
10.5
I
DD
(per channel)
(μA)
600
23
550
1000
OUTPUT DRIVE
±35mA
±10mA
±90mA
±10mA
RAIL-TO-RAIL
I/O
I/O
I/O
O
All specifications measured at 5V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2007, Texas Instruments Incorporated
TLV2470, TLV2471
,
TLV2472, TLV2473
TLV2474, TLV2475, TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
TLV2470 and TLV2471 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
SMALL OUTLINE (D)
(2)
TLV2470CD
TLV2471CD
TLV2470ID
TLV2471ID
TLV2470AID
TLV2471AID
SOT23
(DBV)
(2)
SYMBOL
VAUC
VAVC
VAUI
VAVI
——
PLASTIC DIP (P)
TLV2470CP
TLV2471CP
TLV2470IP
TLV2471IP
TLV2470AIP
TLV2471AIP
0°C to +70°C
TLV2470CDBV
TLV2471CDBV
TLV2470IDBV
TLV2471IDBV
——
–40°C to +125°C
(1)
(2)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2470CDR).
TLV2472 AND TLV2473 AVAILABLE OPTIONS
(1)
PACKAGED DEVICES
T
A
SMALL
OUTLINE
(D)
(2)
TLV2472CD
TLV2473CD
TLV2472ID
TLV2473ID
TLV2472AID
TLV2473AID
MSOP
(DGN)
(2)
MSOP
SYMBOL
(3)
(DGQ)
(2)
SYMBOL
(3)
PLASTIC DIP
(N)
—
TLV2473CN
—
TLV2473IN
—
TLV2473AIN
PLASTIC DIP
(P)
TLV2472CP
—
TLV2472IP
—
TLV2472AIP
—
0°C to +70°C
TLV2472CDGN
—
TLV2472IDGN
—
——
xxTIABU
—
xxTIABV
—
——
—
TLV2473CDGQ
—
TLV2473IDGQ
——
—
xxTIABW
—
xxTIABX
——
–40°C to +125°C
(1)
(2)
(3)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2472CDR).
xx represents the device date code.
TLV2474 and TLV2475 AVAILABLE OPTIONS
(1)
T
A
0°C to +70°C
PACKAGED DEVICES
SMALL OUTLINE (D)
TLV2474CD
TLV2475CD
TLV2474ID
TLV2475ID
TLV2474AID
TLV2475AID
(2)
PLASTIC DIP (N)
TLV2474CN
TLV2475CN
TLV2474IN
TLV2475IN
TLV2474AIN
TLV2475AIN
TSSOP (PWP)
(2)
TLV2474CPWP
TLV2475CPWP
TLV2474IPWP
TLV2475IPWP
TLV2474AIPWP
TLV2475AIPWP
–40°C to +125°C
(1)
(2)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example,
TLV2474CDR).
2
Submit Documentation Feedback
www.ti.com
TLV2470, TLV2471
,
TLV2472, TLV2473
TLV2474, TLV2475, TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
TLV247X PACKAGE PINOUTS
TLV2470
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN+
1
2
3
6
5
4
V
DD
SHDN
IN −
TLV2470
D OR P PACKAGE
(TOP VIEW)
TLV2471
DBV PACKAGE
(TOP VIEW)
NC
IN−
IN+
GND
1
2
3
4
8
7
6
5
SHDN
V
DD
OUT
NC
OUT
GND
IN+
1
2
3
5
V
DD
4
IN −
TLV2471
D OR P PACKAGE
(TOP VIEW)
TLV2472
D, DGN, OR P PACKAGE
(TOP VIEW)
TLV2473
DGQ PACKAGE
(TOP VIEW)
NC
IN−
IN+
GND
1
2
3
4
8
7
6
5
NC
V
DD
OUT
NC
1OUT
1IN−
1IN+
GND
1
2
3
4
8
7
6
5
V
DD
2OUT
2IN−
2IN+
1OUT
1IN−
1IN+
GND
1SHDN
1
2
3
4
5
10
9
8
7
6
V
DD
2OUT
2IN−
2IN+
2SHDN
TLV2473
D OR N PACKAGE
(TOP VIEW)
TLV2474
D, N, OR PWP PACKAGE
(TOP VIEW)
TLV2475
D, N, OR PWP PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
GND
NC
1SHDN
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
2OUT
2IN−
2IN+
NC
2SHDN
NC
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
1/2SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4SHDN
NC − No internal connection
TYPICAL PIN 1 INDICATORS
Pin 1
Printed or
Molded Dot
Pin 1
Stripe
Pin 1
Beveled Edges
Pin 1
Molded
U
Shape
Submit Documentation Feedback
3
TLV2470, TLV2471
,
TLV2472, TLV2473
TLV2474, TLV2475, TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
www.ti.com
DESCRIPTION (CONTINUED)
Three members of the family (TLV2470/3/5) offer a shutdown terminal for conserving battery life in portable
applications. During shutdown, the outputs are placed in a high-impedance state and the amplifier consumes
only 350nA/channel. The family is fully specified at 3V and 5V across an expanded industrial temperature range
(–40°C to +125°C). The singles and duals are available in the SOT23 and MSOP packages, while the quads are
available in TSSOP. The TLV2470 offers an amplifier with shutdown functionality all in a SOT23-6 package,
making it perfect for high-density power-sensitive circuits.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
UNIT
Supply voltage, V
DD
(2)
7V
±V
DD
See
Dissipation Rating
table
C-suffix
I-suffix
0°C to +70°C
–40°C to +125°C
+150°C
–65°C to +150°C
+260°C
Differential input voltage, V
ID
Continuous total power dissipation
Operating free-air temperature range, T
A
Maximum junction temperature, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
(2)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated underrecommended
operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE
D (8)
D (14)
D (16)
DBV (5)
DBV (6)
DGN (8)
DGQ (10)
N (14, 16)
P (8)
PWP (14)
PWP (16)
θ
JC
(°C/W)
38.3
26.9
25.7
55
55
4.7
4.7
32
41
2.07
2.07
θ
JA
(°C/W)
176
122.3
114.7
324.1
294.3
52.7
52.3
78
104
30.7
29.7
T
A
≤
+25°C
POWER RATING
710mW
1022mW
1090mW
385mW
425mW
2.37W
2.39W
1600mW
1200mW
4.07W
4.21W
RECOMMENDED OPERATING CONDITIONS
MIN
Supply voltage, V
DD
Common-mode input voltage range, V
ICR
Operating free-air temperature, T
A
Shutdown on/off voltage level
(1)
(1)
Relative to GND.
C-suffix
I-suffix
V
IH
V
IL
Single supply
Split supply
2.7
±1.35
0
0
–40
2
0.8
MAX
6
±3
V
DD
+70
+125
UNIT
V
V
°C
V
4
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