64-BIT, 1200MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, |
| 针数 | 688 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | 20 |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 1200 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B688 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 端子数量 | 688 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.236 V |
| 最小供电电压 | 1.164 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320TCI6484CMHA2 | TMS320TCI6484CMH | TMS320TCI6484CMHA | TMS320TCI6484CMH2 | TMS320TCI6484GMHA | TMS320TCI6484GMHA2 | |
|---|---|---|---|---|---|---|
| 描述 | 64-BIT, 1200MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688 | 64-BIT, 1000MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688 | IC 64-BIT, 1000 MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688, Digital Signal Processor | 64-BIT, 1200MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688 | 64-BIT, 1000MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688 | 64-BIT, 1200MHz, OTHER DSP, PBGA688, 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, BGA-688 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, |
| 针数 | 688 | 688 | 688 | 688 | 688 | 688 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 20 | 20 | 20 | 20 | 20 | 20 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 1200 MHz | 1000 MHz | 1000 MHz | 1200 MHz | 1000 MHz | 1200 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B688 | S-PBGA-B688 | S-PBGA-B688 | S-PBGA-B688 | S-PBGA-B688 | S-PBGA-B688 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 端子数量 | 688 | 688 | 688 | 688 | 688 | 688 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
| 最大供电电压 | 1.236 V | 1.133 V | 1.133 V | 1.236 V | 1.133 V | 1.236 V |
| 最小供电电压 | 1.164 V | 1.067 V | 1.067 V | 1.164 V | 1.067 V | 1.164 V |
| 标称供电电压 | 1.2 V | 1.1 V | 1.1 V | 1.2 V | 1.1 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
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