QDR SRAM, 512KX36, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | BGA |
包装说明 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 |
针数 | 165 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.2.A |
Base Number Matches | 1 |
CY7C1315V18-167BZC | CY7C1315V18-200BZC | CY7C1315V18-250BZC | CY7C1311V18-250BZC | CY7C1311V18-167BZC | CY7C1311V18-200BZC | CY7C1313V18-250BZC | |
---|---|---|---|---|---|---|---|
描述 | QDR SRAM, 512KX36, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 | 13 X 15 MM, 1.20 MM HEIGHT, 1 MM PITCH, FBGA-165 |
针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | _compli |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | - | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
最长访问时间 | - | 0.45 ns | 0.45 ns | - | - | 0.45 ns | 0.45 ns |
其他特性 | - | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | - | - | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
最大时钟频率 (fCLK) | - | 200 MHz | 250 MHz | - | - | 200 MHz | 250 MHz |
I/O 类型 | - | SEPARATE | SEPARATE | - | - | SEPARATE | SEPARATE |
JESD-30 代码 | - | R-PBGA-B165 | R-PBGA-B165 | - | - | R-PBGA-B165 | R-PBGA-B165 |
JESD-609代码 | - | e0 | e0 | - | - | e0 | e0 |
长度 | - | 15 mm | 15 mm | - | - | 15 mm | 15 mm |
内存密度 | - | 18874368 bit | 18874368 bit | - | - | 16777216 bit | 18874368 bi |
内存集成电路类型 | - | QDR SRAM | QDR SRAM | - | - | QDR SRAM | QDR SRAM |
内存宽度 | - | 36 | 36 | - | - | 8 | 18 |
功能数量 | - | 1 | 1 | - | - | 1 | 1 |
端子数量 | - | 165 | 165 | - | - | 165 | 165 |
字数 | - | 524288 words | 524288 words | - | - | 2097152 words | 1048576 words |
字数代码 | - | 512000 | 512000 | - | - | 2000000 | 1000000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 70 °C | 70 °C | - | - | 70 °C | 70 °C |
组织 | - | 512KX36 | 512KX36 | - | - | 2MX8 | 1MX18 |
输出特性 | - | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | TBGA | TBGA | - | - | TBGA | TBGA |
封装等效代码 | - | BGA165,11X15,40 | BGA165,11X15,40 | - | - | BGA165,11X15,40 | BGA165,11X15,40 |
封装形状 | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - | - | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
并行/串行 | - | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | - | 220 | 220 | - | - | 220 | NOT SPECIFIED |
电源 | - | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V | - | - | 1.5/1.8,1.8 V | 1.5/1.8,1.8 V |
认证状态 | - | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
座面最大高度 | - | 1.2 mm | 1.2 mm | - | - | 1.2 mm | 1.2 mm |
最小待机电流 | - | 1.7 V | 1.7 V | - | - | 1.7 V | 1.7 V |
最大供电电压 (Vsup) | - | 1.9 V | 1.9 V | - | - | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | - | 1.7 V | 1.7 V | - | - | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | - | - | 1.8 V | 1.8 V |
表面贴装 | - | YES | YES | - | - | YES | YES |
技术 | - | CMOS | CMOS | - | - | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | BALL | BALL | - | - | BALL | BALL |
端子节距 | - | 1 mm | 1 mm | - | - | 1 mm | 1 mm |
端子位置 | - | BOTTOM | BOTTOM | - | - | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 13 mm | 13 mm | - | - | 13 mm | 13 mm |
是否无铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 | - |
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