FEATURES AND SPECIFICATIONS
1.09mm (.043") by
1.17mm (.046") Pitch
LGA Socket 771
47213
Vertical
Surface Mount
Molex offers the 771-pin LGA CPU Socket for the Intel Dempsey
Platform Processor
Socket 771 is the first Computer Processing Unit (CPU) socket to be used on the
server/workstation industry featuring the Land Grid Array (LGA) contact design.
This socket is commonly known as Socket J, Socket 771 and LGA 771. This socket
mates with the 771 LGA CPU package (gold pads) to form the processing unit of the
application. Previous design uses the Pin Grid Array (PGA) socket or Micro-PGA
socket (such as socket 604) mated with PGA CPU package. The 771-pin LGA CPU
and Socket will replace the Socket 604 in Intel®Xeon® processor line.
Molex’s high density LGA sockets features our low profile design, the shepard hook
actuation lever and a flat or raised pick and place cover for the assembly process.
All Molex’s LGA sockets comes with lead or lead-free BGA solder balls.
Features
• High-temperature thermoplastic
housing
• Pick-&-place cover and Jedec hard
packaging tray
• LGA contact/BGA solder
• Lead free BGA solder balls
• Shepard hook actuation lever
• Flat or raised pick & place cover
• Visible triangle pin 1 identification on
housing, pick & place cover, stiffener
plate.
• West alignment key.
• 2 finger cutouts on north and south
side
Benefits
• Withstands lead-free processing
• Facilitates automation socket
placement
• Prevents CPU misalignment
• Compliant with environmental needs
• For easy actuation
• Raised cover facilitates easy removal
• Ensure correct CPU loading
• Prevent Socket 775 CPU from mating
to socket 771.
• For easy CPU removal
SPECIFICATIONS
Reference Information
Packaging: JEDEC Thick Handling Hard Tray
UL File No.: E29179
Mates With: Intel®Xeon® Processor family(771-pin Package)
Designed In: Millimeters
Electrical
Voltage: 30V
Current: 0.8A
Contact Resistance: 15.2 milliohms max. average,
28.0 milliohms max. chain
Dielectric Withstanding Voltage: 360V AC
Insulation Resistance: 500 Megohms min.
Mechanical
Insertion Force to Socket: Zero Insertion Force
Durability: 20 cycles
Physical
Housing: LCP, UL 94V-0
Contact: Copper Alloy
Plating:
Contact Area — 0.38 um (15u”) Gold
Solder Tail Area —
Underplating — Nickel
Operating Temperature: -40 to +90°C
MARKETS AND APPLICATIONS
•
Workstation/Low End Server
1.09mm (.043") by
1.17mm (.046") Pitch
LGA Socket 771
47213
Vertical
Surface Mount
ORDERING INFORMATION
Lead-Free
Order No.
Tin-Lead
Order No.
Description
47213-0015
47213-0010
1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,
15u” Gold Plating, Shepherd Hook Lever, Flat Pick & Place Cover
47213-1015
47213-1010
1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,
15u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover
47213-0005
47213-0000
1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits,
30u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover
Intel®Xeon®
is a registered trademark of Intel.
Bringing People & Technology Together, Worldwide
SM
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Visit our Web site at http://www.molex.com
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