ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, DIE-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | -5 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-XUUC-N28 |
| JESD-609代码 | e0 |
| 模拟输入通道数量 | 8 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| MX7581J/D-T | MAX161AMJI-883B | MAX161CMJI-883B | MX7581TQ | MX7581SQ | MAX161BMJI/883B | MX7581JN+ | MAX161CCWI+T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, DIE-28 | Data Acquisition ADCs/DACs - Specialized | Data Acquisition ADCs/DACs - Specialized | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Data Acquisition ADCs/DACs - Specialized | IC DAS 8BIT 8CH 28-DIP | IC DAS 8BIT 8-CH 28-SOIC |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | DIE | - | - | DIP | DIP | DIP | DIP | SOIC |
| 包装说明 | DIE, | - | - | CERDIP-28 | CERDIP-28 | CERDIP-28 | DIP, DIP28,.6 | SOP, SOP28,.5 |
| 针数 | 28 | - | - | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | - | - | not_compliant | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 |
| 最大模拟输入电压 | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最小模拟输入电压 | -5 V | - | - | -5 V | -5 V | -5 V | -5 V | -5 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | - | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-XUUC-N28 | - | - | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e3 | e3 |
| 模拟输入通道数量 | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
| 位数 | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | - | - | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | - | - | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 输出位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | - | - | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
| 输出格式 | PARALLEL, 8 BITS | - | - | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | UNSPECIFIED | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIE | - | - | DIP | DIP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | - | 245 | 245 | 245 | 260 | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | - | NO | NO | NO | NO | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | - | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子位置 | UPPER | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | - | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 最大线性误差 (EL) | - | - | - | 0.293% | 0.7324% | 0.293% | 0.7324% | 0.1953% |
| 湿度敏感等级 | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 封装等效代码 | - | - | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | SOP28,.5 |
| 电源 | - | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 座面最大高度 | - | - | - | 5.89 mm | 5.89 mm | 5.89 mm | 5.08 mm | 2.65 mm |
| 端子节距 | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 宽度 | - | - | - | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.5 mm |
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