Data Acquisition ADCs/DACs - Specialized
| 参数名称 | 属性值 |
| 产品种类 Product Category | Data Acquisition ADCs/DACs - Specialized |
| 制造商 Manufacturer | Maxim(美信半导体) |
| Resolution | 8 bit |
| 最小工作温度 Minimum Operating Temperature | - 55 C |
| 最大工作温度 Maximum Operating Temperature | + 125 C |
| 封装 / 箱体 Package / Case | CDIP-Wide-28 |
| 高度 Height | 3.98 mm (Max) |
| INL - Integral Nonlinearity | +/- 1.875 LSB |
| Input Type | Single Ended |
| 接口类型 Interface Type | Parallel |
| 长度 Length | 37.85 mm (Max) |
| Sampling Rate | 50 kS/s |
| SNR - Signal to Noise Ratio | Yes |
| 电源电压-最大 Supply Voltage - Max | 7 V |
| 电源电压-最小 Supply Voltage - Min | - 0.3 V |
| 宽度 Width | 15.75 mm (Max) |
| MAX161AMJI-883B | MAX161CMJI-883B | MX7581TQ | MX7581SQ | MAX161BMJI/883B | MX7581JN+ | MAX161CCWI+T | MX7581J/D-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Data Acquisition ADCs/DACs - Specialized | Data Acquisition ADCs/DACs - Specialized | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Data Acquisition ADCs/DACs - Specialized | IC DAS 8BIT 8CH 28-DIP | IC DAS 8BIT 8-CH 28-SOIC | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, DIE-28 |
| 是否无铅 | - | - | 含铅 | 含铅 | - | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 零件包装代码 | - | - | DIP | DIP | DIP | DIP | SOIC | DIE |
| 包装说明 | - | - | CERDIP-28 | CERDIP-28 | CERDIP-28 | DIP, DIP28,.6 | SOP, SOP28,.5 | DIE, |
| 针数 | - | - | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | - | - | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant |
| ECCN代码 | - | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最小模拟输入电压 | - | - | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 转换器类型 | - | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | - | - | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-XUUC-N28 |
| JESD-609代码 | - | - | e0 | e0 | e0 | e3 | e3 | e0 |
| 最大线性误差 (EL) | - | - | 0.293% | 0.7324% | 0.293% | 0.7324% | 0.1953% | - |
| 湿度敏感等级 | - | - | 1 | 1 | 1 | 1 | 1 | - |
| 模拟输入通道数量 | - | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 位数 | - | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | - | - | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 输出位码 | - | - | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
| 输出格式 | - | - | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | - | - | DIP | DIP | DIP | DIP | SOP | DIE |
| 封装等效代码 | - | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | SOP28,.5 | - |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | UNCASED CHIP |
| 峰值回流温度(摄氏度) | - | - | 245 | 245 | 245 | 260 | 260 | NOT SPECIFIED |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 5.89 mm | 5.89 mm | 5.89 mm | 5.08 mm | 2.65 mm | - |
| 标称供电电压 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | NO | NO | NO | NO | YES | YES |
| 技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD |
| 端子形式 | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | NO LEAD |
| 端子节距 | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | - | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.5 mm | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved