OTP ROM, 8KX8, 100ns, Bipolar, CDFP24, CERAMIC, DFP-24
| 参数名称 | 属性值 |
| Objectid | 1516180402 |
| 包装说明 | CERAMIC, DFP-24 |
| Reach Compliance Code | unknown |
| YTEOL | 0 |
| 最长访问时间 | 100 ns |
| JESD-30 代码 | R-CDFP-F24 |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| 8200901XA | 8200901JX | 8200901XC | 8200901LA | 8200901XX | 8200901JA | 8200901LC | 8200901LX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 8KX8, 100ns, Bipolar, CDFP24, CERAMIC, DFP-24 | OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, CERAMIC, DIP-24 | OTP ROM, 8KX8, 100ns, Bipolar, CDFP24, | OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, CERAMIC, DIP-24 | OTP ROM, 8KX8, 100ns, Bipolar, CDFP24, CERAMIC, DFP-24 | OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, CERAMIC, DIP-24 | OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, | OTP ROM, 8KX8, 100ns, Bipolar, CDIP24, CERAMIC, DIP-24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 45 ns | 100 ns | 100 ns |
| JESD-30 代码 | R-CDFP-F24 | R-GDIP-T24 | R-CDFP-F24 | R-GDIP-T24 | R-CDFP-F24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 1024 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 4 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 256 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 256X4 | 8KX8 | 8KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DFP | DIP | DFP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | CERAMIC, DFP-24 | CERAMIC, DIP-24 | - | CERAMIC, DIP-24 | CERAMIC, DFP-24 | CERAMIC, DIP-24 | - | CERAMIC, DIP-24 |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
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