American Opto Plus LED
SMC/A-401SR G/W
0.40’’ SINGLE DIGIT DISPLAY
0.40inch (10.16 mm) digit height
Low power consumption
RoHS Compliance
Case mold type
Package Dimensions
Notes: 1. All dimensions are in millimeters
2. Tolerance is ± 0.25mm unless otherwise noted.
Internal Circuit Diagram
COMMON ANODE
COMMON CATHODE
March 2005 Rev. 1.0
American Opto Plus LED
SMC/A-401SR G/W
0.40’’ SINGLE DIGIT DISPLAY
0.40inch (10.16 mm) digit height
Low power consumption
RoHS Compliance
Case mold type
DEVICE SELECTION GUIDE
Part Number
SMC/A-401SR G/W
Material
GaAlAs/GaAs
Chip
Emitted Color
Super Red
Face / Segment
Gray / White
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Dissipation per segment
Peak Current per segment (1/10 Duty Cycle @1KHz )
Continuous Forward Current per segment
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
(Ta=25°C)
Symbol
Pd
Ipf
If
VR
TOPR
TSTG
Max Rating
75
200
30
5.0
-40~+105
-40~+105
Unit
mW
mA
mA
V
°C
°C
Solder temperature 1.6 mm from body for 3 seconds at 260°C
OPTICAL-ELECTRICAL CHARACTERISTICS
Parameter
Ave. Luminous Intensity
Per segment
Forward Voltage/segment
Reverse Current/segment
Spectrum Line Half-Width
Dominant Wavelength
Symbol Test Condition
IV
VF
IR
Δλ
λd
IF = 10mA
IF = 20mA
VR = 5V
IF = 20mA
IF = 20mA
Min
3000
Typ
8000
1.8
Max
--
2.5
100
Unit
μcd
V
uA
nm
nm
20
660
March 2005 Rev. 1.0
American Opto Plus LED
SMC/A-401SR G/W
0.40’’ SINGLE DIGIT DISPLAY
0.40inch (10.16 mm) digit height
Low power consumption
RoHS Compliance
Case mold type
Typical Electro-Optical Characteristic Curves (Ambient Temperature: 25
°
C)
Forward Current vs. Forward Voltage
Spectral Response
Relative Luminous Intensity vs. Forward Current
Luminous Intensity vs. Duty Cycle
Maximum Allowance DC Current Per Segment vs. A
Fuction of Ambient Temperature
Maximum Peak Current vs. Duty Cycle %
March 2005 Rev. 1.0
American Opto Plus LED
SMC/A-401SR G/W
0.40’’ SINGLE DIGIT DISPLAY
0.40inch (10.16 mm) digit height
Low power consumption
RoHS Compliance
Case mold type
Soldering heat reliability (DIP)
Reflow Temp / Time
Soldering iron:
Basic spec is
≤
4 sec when 260°C. If temperature is higher, time should be shorter (+10°C 1 sec).
Power dissipation of iron should be smaller than 15W, and temperature should be controllable.
Surface temperature of the device should be under 230°C.
Rework:
1.
2.
Customer must finish rework within 4 sec under 245°C.
The head of iron cannot touch copper foil.
RECOMMENDED SOLDERING PATTERN (UNIT: mm)
March 2005 Rev. 1.0