IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 正常位置 | NC |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 125 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长接通时间 | 200 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| DG309BK | DG308AAK | DG308ABK | DG308ACK | DG309CK | |
|---|---|---|---|---|---|
| 描述 | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC | IC,ANALOG SWITCH,QUAD,SPST,CMOS,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 正常位置 | NC | NO | NO | NO | NC |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 125 Ω | 150 Ω | 125 Ω | 125 Ω | 125 Ω |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C |
| 最低工作温度 | -25 °C | -55 °C | -25 °C | - | - |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 最长接通时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | MILITARY | OTHER | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 包装说明 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - |
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