电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

5962-8851701YC

产品描述D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32
产品类别模拟混合信号IC    转换器   
文件大小187KB,共4页
制造商Data Device Corporation
下载文档 详细参数 选型对比 全文预览

5962-8851701YC概述

D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32

5962-8851701YC规格参数

参数名称属性值
零件包装代码DFP
包装说明DFP, FL32,1.1,100
针数32
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最大模拟输出电压10 V
最小模拟输出电压-10 V
转换器类型D/A CONVERTER
输入位码BINARY, OFFSET BINARY
输入格式PARALLEL, WORD
JESD-30 代码R-CDFP-F32
JESD-609代码e4
最大线性误差 (EL)0.012%
标称负供电电压-15 V
位数14
功能数量1
端子数量32
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装等效代码FL32,1.1,100
封装形状RECTANGULAR
封装形式FLATPACK
电源5,+-15 V
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度4.45 mm
最大稳定时间1.8 µs
最大压摆率130 mA
标称供电电压15 V
表面贴装YES
技术HYBRID
温度等级MILITARY
端子面层GOLD
端子形式FLAT
端子节距2.54 mm
端子位置DUAL
Base Number Matches1

5962-8851701YC相似产品对比

5962-8851701YC 5962-8851701YA 5962-8851701XA 5962-8851702XC 5962-8851701XC 5962-8851702YC 5962-8851702YA 5962-8851702XA
描述 D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP32, CERAMIC, DIP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP32, CERAMIC, DIP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP32, CERAMIC, DIP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDFP32, CERAMIC, DFP-32 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP32, CERAMIC, DIP-32
零件包装代码 DFP DFP DIP DIP DIP DFP DFP DIP
包装说明 DFP, FL32,1.1,100 CERAMIC, DFP-32 CERAMIC, DIP-32 CERAMIC, DIP-32 DIP, DIP32,.9 CERAMIC, DFP-32 DFP, FL32,1.1,100 DIP, DIP32,.9
针数 32 32 32 32 32 32 32 32
Reach Compliance Code compliant compliant unknown compliant compliant compliant unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最大模拟输出电压 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V
最小模拟输出电压 -10 V -10 V -10 V -10 V -10 V -10 V -10 V -10 V
转换器类型 D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER
输入位码 BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY
输入格式 PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
JESD-30 代码 R-CDFP-F32 R-CDFP-F32 R-CDIP-P32 R-CDIP-P32 R-CDIP-P32 R-CDFP-F32 R-CDFP-F32 R-CDIP-P32
JESD-609代码 e4 e0 e0 e4 e4 e4 e0 e0
最大线性误差 (EL) 0.012% 0.012% 0.012% 0.006% 0.012% 0.006% 0.006% 0.006%
标称负供电电压 -15 V -15 V -15 V -15 V -15 V -15 V -15 V -15 V
位数 14 14 14 14 14 14 14 14
功能数量 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DFP DFP DIP DIP DIP DFP DFP DIP
封装等效代码 FL32,1.1,100 FL32,1.1,100 DIP32,.9 DIP32,.9 DIP32,.9 FL32,1.1,100 FL32,1.1,100 DIP32,.9
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK IN-LINE
电源 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
座面最大高度 4.45 mm 4.45 mm 5.3 mm 5.3 mm 5.3 mm 4.45 mm 4.45 mm 5.3 mm
最大稳定时间 1.8 µs 1.8 µs 1.8 µs 1.8 µs 1.8 µs 1.8 µs 1.8 µs 1.8 µs
最大压摆率 130 mA 130 mA 130 mA 130 mA 130 mA 130 mA 130 mA 130 mA
标称供电电压 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V
表面贴装 YES YES NO NO NO YES YES NO
技术 HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID HYBRID
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 GOLD TIN LEAD TIN LEAD GOLD GOLD GOLD TIN LEAD TIN LEAD
端子形式 FLAT FLAT PIN/PEG PIN/PEG PIN/PEG FLAT FLAT PIN/PEG
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1 1
厂商名称 - - Data Device Corporation Data Device Corporation Data Device Corporation Data Device Corporation - Data Device Corporation

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1677  2262  1912  254  2627  6  40  17  52  50 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved