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IDT70V3579S5BCG: 产品描述Dual-Port SRAM, 32KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256; 产品类别存储存储; 文件大小181KB，共17页; 制造商IDT (Integrated Device Technology); 标准

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IDT70V3579S5BCG概述

Dual-Port SRAM, 32KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256

IDT70V3579S5BCG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	BGA
包装说明	LBGA, BGA256,16X16,40
针数	256
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	5 ns
其他特性	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE
最大时钟频率 (fCLK)	100 MHz
I/O 类型	COMMON
JESD-30 代码	S-PBGA-B256
JESD-609代码	e1
长度	17 mm
内存密度	1179648 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	36
湿度敏感等级	3
功能数量	1
端口数量	2
端子数量	256
字数	32768 words
字数代码	32000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32KX36
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA256,16X16,40
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
电源	2.5/3.3,3.3 V
认证状态	Not Qualified
座面最大高度	1.7 mm
最小待机电流	3.15 V
最大压摆率	0.36 mA
最大供电电压 (Vsup)	3.45 V
最小供电电压 (Vsup)	3.15 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	17 mm
Base Number Matches	1

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HIGH-SPEED 3.3V 32K x 36

SYNCHRONOUS PIPELINED

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features:

◆

IDT70V3579S

◆

True Dual-Port memory cells which allow simultaneous

access of the same memory location

High-speed clock to data access

– Commercial: 4.2/5/6ns (max.)

– Industrial: 5ns (max)

Pipelined output mode

Counter enable and reset features

Dual chip enables allow for depth expansion without

additional logic

Full synchronous operation on both ports

– 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth)

– Fast 4.2ns clock to data out

– 1.8ns setup to clock and 0.7ns hold on all control, data, and

address inputs @ 133MHz

◆

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

LVTTL- compatible, single 3.3V (±150mV) power supply for

core

LVTTL compatible, selectable 3.3V (±150mV)/2.5V (±125mV)

power supply for I/Os and control signals on each port

Industrial temperature range (-40°C to +85°C) is

available for selected speeds

Available in a 208-pin Plastic Quad Flatpack (PQFP) and

208-pin fine pitch Ball Grid Array, and 256-pin Ball Grid

Array

Green parts available, see ordering information

Functional Block Diagram

R/W

B B

2 3

L L

2 1

R/W

Dout0-8_L

Dout9-17_L

Dout18-26_L

Dout27-35_L

Dout0-8_R

Dout9-17_R

Dout18-26_R

Dout27-35_R

32K x 36

MEMORY

ARRAY

I/O

- I/O

35L

Din_L

Din_R

I/O

- I/O

35R

CLK

14L

CNTRST

ADS

CNTEN

CLK

Counter/

Address

Reg.

14R

ADDR_L

ADDR_R

Counter/

Address

Reg.

CNTRST

ADS

CNTEN

4830 tbl 01

FEBRUARY 2006

DSC 4830/15

IDT70V3579S5BCG相似产品对比

	IDT70V3579S5BCG	IDT70V3579S5BFG	IDT70V3579S6BFG	IDT70V3579S5BFGI	IDT70V3579S6DRG	IDT70V3579S5DRG	IDT70V3579S5DRGI	IDT70V3579S6BCG	IDT70V3579S4DRG
描述	Dual-Port SRAM, 32KX36, 5ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 32KX36, 5ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-205EAG, FBGA-208	Dual-Port SRAM, 32KX36, 6ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-205EAG, FBGA-208	Dual-Port SRAM, 32KX36, 5ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, MO-205EAG, FBGA-208	Dual-Port SRAM, 32KX36, 6ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, MO-143FA-1, QFP-208	Dual-Port SRAM, 32KX36, 5ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, MO-143FA-1, QFP-208	Dual-Port SRAM, 32KX36, 5ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, MO-143FA-1, QFP-208	Dual-Port SRAM, 32KX36, 6ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256	Dual-Port SRAM, 32KX36, 4.2ns, CMOS, PQFP208, 28 X 28 MM, 3.50 MM HEIGHT, GREEN, PLASTIC, MO-143FA-1, QFP-208
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	QFP	QFP	QFP	BGA	QFP
包装说明	LBGA, BGA256,16X16,40	LFBGA, BGA208,17X17,32	LFBGA, BGA208,17X17,32	LFBGA, BGA208,17X17,32	FQFP, QFP208,1.2SQ,20	FQFP, QFP208,1.2SQ,20	FQFP, QFP208,1.2SQ,20	LBGA, BGA256,16X16,40	FQFP, QFP208,1.2SQ,20
针数	256	208	208	208	208	208	208	256	208
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	5 ns	5 ns	6 ns	5 ns	6 ns	5 ns	5 ns	6 ns	4.2 ns
其他特性	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE	PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE
最大时钟频率 (fCLK)	100 MHz	100 MHz	83 MHz	100 MHz	83 MHz	100 MHz	100 MHz	83 MHz	133 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	S-PBGA-B256	S-PBGA-B208	S-PBGA-B208	S-PBGA-B208	S-PQFP-G208	S-PQFP-G208	S-PQFP-G208	S-PBGA-B256	S-PQFP-G208
JESD-609代码	e1	e1	e1	e1	e3	e3	e3	e1	e3
长度	17 mm	15 mm	15 mm	15 mm	28 mm	28 mm	28 mm	17 mm	28 mm
内存密度	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	36	36	36	36	36	36	36	36	36
湿度敏感等级	3	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2	2
端子数量	256	208	208	208	208	208	208	256	208
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C
组织	32KX36	32KX36	32KX36	32KX36	32KX36	32KX36	32KX36	32KX36	32KX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LBGA	LFBGA	LFBGA	LFBGA	FQFP	FQFP	FQFP	LBGA	FQFP
封装等效代码	BGA256,16X16,40	BGA208,17X17,32	BGA208,17X17,32	BGA208,17X17,32	QFP208,1.2SQ,20	QFP208,1.2SQ,20	QFP208,1.2SQ,20	BGA256,16X16,40	QFP208,1.2SQ,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	GRID ARRAY, LOW PROFILE	FLATPACK, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260	260	260
电源	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V	2.5/3.3,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.7 mm	1.7 mm	1.7 mm	1.7 mm	4.1 mm	4.1 mm	4.1 mm	1.7 mm	4.1 mm
最小待机电流	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
最大压摆率	0.36 mA	0.36 mA	0.31 mA	0.415 mA	0.31 mA	0.36 mA	0.415 mA	0.31 mA	0.46 mA
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN	MATTE TIN	MATTE TIN	Tin/Silver/Copper (Sn/Ag/Cu)	MATTE TIN
端子形式	BALL	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	BALL	GULL WING
端子节距	1 mm	0.8 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm	1 mm	0.5 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD	BOTTOM	QUAD
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30	30	30
宽度	17 mm	15 mm	15 mm	15 mm	28 mm	28 mm	28 mm	17 mm	28 mm
Base Number Matches	1	1	1	1	1	-	-	-	-
厂商名称	-	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

IDT70V3579S5BCG

IDT70V3579S5BCG概述

IDT70V3579S5BCG规格参数

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