Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.350 INCH, PLASTIC, SOIC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SOP, SOP28,.3 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 55 ns |
| 其他特性 | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 18.085 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | NON-VOLATILE SRAM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.035 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 8.765 mm |
| Base Number Matches | 1 |
| STK11C88-3S55 | STK11C88-3S55I | STK11C88-3N55I | STK11C88-3N55 | STK11C88-3W55I | STK11C88-3P55 | |
|---|---|---|---|---|---|---|
| 描述 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.350 INCH, PLASTIC, SOIC-28 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.350 INCH, PLASTIC, SOIC-28 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Non-Volatile SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SOP, SOP28,.3 | SOP, SOP28,.3 | SOP, SOP28,.4 | SOP, SOP28,.4 | DIP, DIP28,.6 | DIP, DIP28,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| 其他特性 | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM | STORE EEPROM SOFTWARE; 100-YEAR DATA RETENTION IN EEPROM |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.085 mm | 18.085 mm | 17.935 mm | 17.935 mm | 36.83 mm | 34.67 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM | NON-VOLATILE SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | DIP | DIP |
| 封装等效代码 | SOP28,.3 | SOP28,.3 | SOP28,.4 | SOP28,.4 | DIP28,.6 | DIP28,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 2.54 mm | 2.64 mm | 2.64 mm | 4.57 mm | 4.57 mm |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.035 mA | 0.037 mA | 0.037 mA | 0.035 mA | 0.037 mA | 0.035 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 8.765 mm | 8.765 mm | 7.505 mm | 7.505 mm | 15.24 mm | 7.62 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - | - |
| 厂商名称 | - | Simtek | Simtek | Simtek | Simtek | Simtek |
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