Bi-Directional FIFO, 512X18, 21ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | PGA |
包装说明 | CAVITY-UP, CERAMIC, PGA-68 |
针数 | 68 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 21 ns |
最大时钟频率 (fCLK) | 28 MHz |
周期时间 | 35 ns |
JESD-30 代码 | S-CPGA-P68 |
JESD-609代码 | e0 |
内存密度 | 9216 bit |
内存集成电路类型 | BI-DIRECTIONAL FIFO |
内存宽度 | 18 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 512 words |
字数代码 | 512 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512X18 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA |
封装等效代码 | PGA68,11X11 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
最大待机电流 | 0.25 A |
最大压摆率 | 0.25 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG |
端子节距 | 2.54 mm |
端子位置 | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
IDT72605L35GB | IDT72615L50GB | IDT72605L50GB | IDT72615L30GB | IDT72615L35GB | IDT72605L30GB | |
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描述 | Bi-Directional FIFO, 512X18, 21ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Bi-Directional FIFO, 1KX18, 25ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Bi-Directional FIFO, 512X18, 25ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Bi-Directional FIFO, 1KX18, 18ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Bi-Directional FIFO, 1KX18, 21ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 | Bi-Directional FIFO, 512X18, 18ns, Synchronous, CMOS, CPGA68, CAVITY-UP, CERAMIC, PGA-68 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
包装说明 | CAVITY-UP, CERAMIC, PGA-68 | CAVITY-UP, CERAMIC, PGA-68 | CAVITY-UP, CERAMIC, PGA-68 | CAVITY-UP, CERAMIC, PGA-68 | CAVITY-UP, CERAMIC, PGA-68 | CAVITY-UP, CERAMIC, PGA-68 |
针数 | 68 | 68 | 68 | 68 | 68 | 68 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 21 ns | 25 ns | 25 ns | 18 ns | 21 ns | 18 ns |
最大时钟频率 (fCLK) | 28 MHz | 20 MHz | 20 MHz | 33 MHz | 28 MHz | 33 MHz |
周期时间 | 35 ns | 50 ns | 50 ns | 30 ns | 35 ns | 30 ns |
JESD-30 代码 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 9216 bit | 18432 bit | 9216 bit | 18432 bit | 18432 bit | 9216 bit |
内存集成电路类型 | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 512 words | 1024 words | 512 words | 1024 words | 1024 words | 512 words |
字数代码 | 512 | 1000 | 512 | 1000 | 1000 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 512X18 | 1KX18 | 512X18 | 1KX18 | 1KX18 | 512X18 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | PGA | PGA | PGA | PGA | PGA |
封装等效代码 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
最大待机电流 | 0.25 A | 0.25 A | 0.25 A | 0.25 A | 0.25 A | 0.25 A |
最大压摆率 | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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