D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, QSOP-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | SOP, SSOP20,.25 |
| Reach Compliance Code | not_compliant |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.048 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SSOP20,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 4.2 ns |
| 传播延迟（tpd） | 5.5 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 74FCT373CTQ8 | 74FCT373CTPY8 | 74FCT373ATPY8 | 74FCT373ATQ8 | 74FCT373ATSO8 | 74FCT373CTSO8 | 74FCT373TPG | |
|---|---|---|---|---|---|---|---|
| 描述 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, QSOP-20 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SSOP-20 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SSOP-20 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, QSOP-20 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SOIC-20 | D Latch, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, SOIC-20 | D Latch, 1-Func, 8-Bit, CMOS, PDSO20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 包装说明 | SOP, SSOP20,.25 | SOP, SSOP20,.3 | SOP, SSOP20,.3 | SOP, SSOP20,.25 | SOP, SOP20,.4 | SOP, SOP20,.4 | , |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e3 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | BUS DRIVER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 传播延迟（tpd） | 5.5 ns | 5.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 5.5 ns | 13 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | - |
| 封装等效代码 | SSOP20,.25 | SSOP20,.3 | SSOP20,.3 | SSOP20,.25 | SOP20,.4 | SOP20,.4 | - |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 峰值回流温度（摄氏度） | 225 | 225 | 260 | 225 | 260 | 225 | - |
| Prop。Delay @ Nom-Sup | 4.2 ns | 4.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 4.2 ns | - |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 6 | 30 | 6 | 30 | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 厂商名称 | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) |
DSP 与 ARM 处理器
工业自动化与控制
无线连接
FPGA/CPLD
stm32/stm8
DSP 与 ARM 处理器
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