Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
Page 34
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Terminals for Peel-A-Way
®
Low Insertion Force PGA Sockets
Standard Quick Turn Terminals
Type -33
.072 Dia.
(1.83)
Type -51
.072 Dia.
(1.83)
Type -04
.072 Dia.
(1.83)
Type -49
.072 Dia.
(1.83)
Type -85
.058 Dia.
(1.47)
.095
(2.41)
.165
(4.19)
.130
(3.30)
.120
(3.05)
.031
(.79)
.155
(3.94)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.110
(2.79)
.028 Dia.
(.71)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
.038 Dia.
(.97)
PGA
Type -50
.072 Dia.
(1.83)
Type -176
.058 Dia.
(1.47)
Type -210
Not for use with RTV Seal
.058 Dia.
(1.47)
.031
(.79)
.155
(3.94)
.031
(.79)
.155
(3.95)
.015
(.38)
.155
(3.94)
Quick turn delivery
available on standard terminal types.
Additional terminal types available.
See terminal section for detailed terminal information.
.053 Dia.
(1.35)
.034 Dia.
(.86)
.034 Dia.
(.86)
Solder Preform PGA Sockets - Intrusive Reflow Application
Polyimide Film
Solder Preform
PC Board
Preform After
Solder Flow
Solder Preform Terminals
Type -150
Type -151
.072 Dia.
(1.83)
Features:
• Combines the labor of socket loading and
solder application into one operation.
• Eliminates the use of solder paste and
screening operation.
• Eliminates solder bridges and/or solder
shorts due to excess solder.
• Insures a reliable solder joint with
controlled solder volume.
• Ideal for surface mount and mixed
technology applications.
• For custom solder preform terminal
applications consult factory.
• See previous page for material
specifications and how to order information.
.072 Dia.
(1.83)
.072 Dia.
(1.83)
.165
.165
(4.19)
(4.19)
Solder
Preform
.125
.125
(3.18)
(3.18)
.020 Dia.
(.51)
.130
(3.30)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.020 Dia.
(.51)
Type -111
.058 Dia.
(1.47)
Solder
Preform
.031
(.79)
.155
(3.94)
.038 Dia.
(.97)
Peel-A-Way
®
covered by patent rights issued and/or pending.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 35
Microchip MCU
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