1. A-to-B data flow shown; B-to-A flow control is the same, except using CEBA, LEBA, and OEBA.
2. Data prior to LEAB LOW-to-HIGH Transition H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
5. Typical values are at V
CC
= 3.3V, T
A
= +25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I
OS
tests should be performed last.
Capacitance
[6]
(T
A
= +25˚C, f = 1.0 MHz)
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
V
IN
= 0V
V
OUT
= 0V
Test Conditions
Typ.
[5]
4.5
5.5
Max.
6.0
8.0
Unit
pF
pF
3
CY74FCT163543
Power Supply Characteristics
Parameter
I
CC
∆I
CC
I
CCD
Description
Quiescent Power Supply Current V
CC
=Max.
Quiescent Power Supply Current
(TTL inputs HIGH)
Dynamic Power Supply
Current
[9]
Total Power Supply Current
[10]
V
CC
=Max.
V
CC
=Max., One Input
Toggling, 50% Duty Cycle,
Outputs Open, OE=GND
V
CC
=Max., f
1
=10 MHz,
50% Duty Cycle, Outputs
Open, One Bit Toggling,
OE=GND
V
CC
=Max., f
1
=2.5 MHz,
50% Duty Cycle, Outputs
Open, Sixteen Bits Toggling,
OE=GND
Test Conditions
V
IN
≤0.2V,
V
IN
≥V
CC
−0.2V
V
IN
=V
CC
-0.6V
[8]
V
IN
=V
CC
or
V
IN
=GND
V
IN
=V
CC
or
V
IN
=GND
V
IN
=V
CC
-0.6V or
V
IN
=GND
V
IN
=V
CC
or
V
IN
=GND
V
IN
=V
CC
-0.6V or
V
IN
=GND
Typ.
[5]
0.1
2.0
50
Max.
10
30
75
Unit
µA
µA
µA/MHz
I
C
0.5
0.5
2.0
2.0
0.8
0.8
3.0
[11]
3.3
[11]
mA
mA
mA
mA
Switching Characteristics
Over the Operating Range V
CC
= 3.0V to 3.6V
[12,15]
CY74FCT163543A
Parameter
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SU
t
H
t
W
t
SK(O)
Description
Propagation Delay, Transparent Mode
A to B or B to A
Propagation Delay
LEBA to A, LEAB to B
Output Enable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
Output Disable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
Set-up Time HIGH or LOW
A or B to LEAB or LEBA
Hold Time HIGH or LOW
A or B to LEAB or LEBA
LEBA or LEAB Pulse Width LOW
Output Skew
[14]
Min.
1.5
1.5
1.5
Max.
6.5
8.0
9.0
CY74FCT163543C
Min.
1.5
1.5
1.5
Max.
5.1
5.6
7.8
Unit
ns
ns
ns
Fig. No.
[13]
1, 3
1, 5
1, 7, 8
1.5
7.5
1.5
6.5
ns
1, 7, 8
2.0
2.0
4.0
—
—
—
—
0.5
2.0
2.0
4.0
—
—
—
—
0.5
ns
ns
ns
ns
4
4
5
—
Notes:
8. Per TTL driven input; all other inputs at V
CC
or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10.
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+∆I
CC
D
H
N
T
+I
CCD
(f
0
N
C
/2 + f
1
N
1
)
I
CC
= Quiescent Current with CMOS input levels
∆I
CC
= Power Supply Current for a TTL HIGH input (V
IN
=3.4V)
= Duty Cycle for TTL inputs HIGH
D
H
= Number of TTL inputs at D
H
N
T
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f
0
= Number of clock inputs changing at f
1
N
C
f
1
= Input signal frequency
= Number of inputs changing at f
1
N
1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the I
CC
formula. These limits are specified but not tested.
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
14. Skew between any two outputs of the same package switching in the same directional. This parameter is ensured by design.
15. For V
CC
=2.7, propagation delay, output enable and output disable times should be degraded by 20%.
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