asynchronous ECL divide
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Zarlink Semiconductor (Microsemi) |
包装说明 | DIP, |
Reach Compliance Code | unknow |
系列 | 8611 |
JESD-30 代码 | R-GDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | PRESCALER |
数据/时钟输入次数 | 1 |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 110 °C |
最低工作温度 | -55 °C |
输出特性 | EMITTER FOLLOWER |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
表面贴装 | NO |
技术 | ECL |
温度等级 | OTHER |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
最小 fmax | 1300 MHz |
SP8611ADG | SP8610 | SP8610AADG | SP8610ADG | SP8610BDG | SP8610NA1C | SP8611 | SP8611AADG | SP8611BDG | SP8611NA1C | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
包装说明 | DIP, | - | DIP, | DIP, | DIP, | DIE, | - | DIP, | DIP, | DIE, |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | - | unknow | unknow | unknow |
系列 | 8611 | - | 8610 | 8610 | 8610 | 8610 | - | 8611 | 8611 | 8611 |
JESD-30 代码 | R-GDIP-T14 | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | X-XUUC-N | - | R-GDIP-T14 | R-GDIP-T14 | X-XUUC-N |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
逻辑集成电路类型 | PRESCALER | - | PRESCALER | PRESCALER | PRESCALER | PRESCALER | - | PRESCALER | PRESCALER | PRESCALER |
数据/时钟输入次数 | 1 | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 14 | - | 14 | 14 | 14 | - | - | 14 | 14 | - |
最高工作温度 | 110 °C | - | 125 °C | 110 °C | 70 °C | 125 °C | - | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | - | -55 °C | -55 °C | - | -55 °C | - | -55 °C | - | -55 °C |
输出特性 | EMITTER FOLLOWER | - | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | - | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER |
输出极性 | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
封装代码 | DIP | - | DIP | DIP | DIP | DIE | - | DIP | DIP | DIE |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
封装形式 | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | UNCASED CHIP | - | IN-LINE | IN-LINE | UNCASED CHIP |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm | - | - | 5.08 mm | 5.08 mm | - |
表面贴装 | NO | - | NO | NO | NO | YES | - | NO | NO | YES |
技术 | ECL | - | ECL | ECL | ECL | ECL | - | ECL | ECL | ECL |
温度等级 | OTHER | - | MILITARY | OTHER | COMMERCIAL | MILITARY | - | MILITARY | COMMERCIAL | MILITARY |
端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | - | - | 2.54 mm | 2.54 mm | - |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | UPPER | - | DUAL | DUAL | UPPER |
宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | - | - | 7.62 mm | 7.62 mm | - |
最小 fmax | 1300 MHz | - | 1000 MHz | 1000 MHz | 1000 MHz | 1000 MHz | - | 1300 MHz | 1500 MHz | 1300 MHz |
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