RAD-HARD TRIPLE 3-INPUT AND GATE
| M54HC11_04 | M54HC11K | M54HC11D | M54HC11 | M54HC11K1 | M54HC11D1 | |
|---|---|---|---|---|---|---|
| 描述 | RAD-HARD TRIPLE 3-INPUT AND GATE | RAD-HARD TRIPLE 3-INPUT AND GATE | RAD-HARD TRIPLE 3-INPUT AND GATE | RAD-HARD TRIPLE 3-INPUT AND GATE | RAD-HARD TRIPLE 3-INPUT AND GATE | RAD-HARD TRIPLE 3-INPUT AND GATE |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | DFP | DIP | - | DFP | DIP |
| 包装说明 | - | DFP, FL14,.3 | DIP, DIP14,.3 | - | DFP, FL14,.3 | DIP, DIP14,.3 |
| 针数 | - | 14 | 14 | - | 14 | 14 |
| Reach Compliance Code | - | _compli | _compli | - | _compli | _compli |
| 系列 | - | HC/UH | HC/UH | - | HC/UH | HC/UH |
| JESD-30 代码 | - | R-CDFP-F14 | R-CDIP-T14 | - | R-CDFP-F14 | R-CDIP-T14 |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 |
| 长度 | - | 9.95 mm | 19 mm | - | 9.95 mm | 19 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | AND GATE | AND GATE | - | AND GATE | AND GATE |
| 最大I（ol） | - | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A |
| 功能数量 | - | 3 | 3 | - | 3 | 3 |
| 输入次数 | - | 3 | 3 | - | 3 | 3 |
| 端子数量 | - | 14 | 14 | - | 14 | 14 |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 封装主体材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | - | DFP | DIP | - | DFP | DIP |
| 封装等效代码 | - | FL14,.3 | DIP14,.3 | - | FL14,.3 | DIP14,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | FLATPACK | IN-LINE | - | FLATPACK | IN-LINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 2/6 V | 2/6 V | - | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | - | 26 ns | 26 ns | - | 26 ns | 26 ns |
| 传播延迟（tpd） | - | 130 ns | 130 ns | - | 130 ns | 130 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | - | NO | NO |
| 最大供电电压 (Vsup) | - | 6 V | 6 V | - | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | 2 V | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 表面贴装 | - | YES | NO | - | YES | NO |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | - | TIN LEAD | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | - | FLAT | THROUGH-HOLE | - | FLAT | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 2.54 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 总剂量 | - | 50k Rad(Si) V | 50k Rad(Si) V | - | 50k Rad(Si) V | 50k Rad(Si) V |
| 宽度 | - | 6.91 mm | 7.62 mm | - | 6.91 mm | 7.62 mm |
微控制器 MCU
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MEMS传感器
嵌入式系统
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