电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89HPES24T3G2ZBBL

产品描述FCBGA-676, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小651KB,共51页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览 文档解析

89HPES24T3G2ZBBL在线购买

供应商 器件名称 价格 最低购买 库存  
89HPES24T3G2ZBBL - - 点击查看 点击购买

89HPES24T3G2ZBBL概述

FCBGA-676, Tray

89HPES24T3G2ZBBL规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
零件包装代码FCBGA
包装说明27 X 27 MM, 1 MM PITCH, FCBGA-676
针数676
制造商包装代码BL676
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B676
JESD-609代码e0
长度27 mm
湿度敏感等级4
端子数量676
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA676,26X26,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,2.5,3.3 V
认证状态Not Qualified
座面最大高度3.22 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度27 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档解析

设计高性能应用时,考虑IDT的89HPES24T3G2 PCI Express®开关解决方案需要关注以下几个关键方面:

  1. 性能需求:首先,确定应用的性能需求,包括所需的带宽、延迟和数据传输速率。89HPES24T3G2提供24个5 Gbps Gen2 PCI Express通道,支持高性能应用。

  2. 端口配置:该设备是一个24通道、3端口的开关,提供PCI Express上游端口和两个下游端口之间的连接和切换功能。根据应用需求,规划端口的配置和使用。

  3. 灵活性和可配置性:89HPES24T3G2提供多种配置选项,包括端口链接宽度的自动协商、自动车道反转、自动极性反转等。利用这些功能可以根据应用需求动态调整硬件配置。

  4. 兼容性和支持:确保所设计的系统与89HPES24T3G2的PCI Express兼容,包括支持的最大有效载荷大小(高达2048字节)、虚拟通道和流量类别。

  5. 可靠性、可用性和可服务性(RAS):该设备包括禁用点对点通信的能力、ECRC和高级错误报告等RAS特性。在设计时考虑这些特性以提高系统的可靠性和容错能力。

  6. 电源管理:利用89HPES24T3G2的低功耗设计技术,包括PCI电源管理接口规范(PCIPM 1.1)和PCI Express活动状态电源管理(ASPM)。

  7. 热设计:考虑设备的热特性和散热要求,确保系统设计能够满足器件的最大结温(TJ(max))和热阻要求。

  8. 测试和调试:使用89HPES24T3G2提供的测试和调试特性,如端口链接状态输出、SerDes测试模式和性能计数器,以简化系统集成和故障排除。

  9. 物理设计:根据所选封装选项(19mm x 19mm或27mm x 27mm),考虑信号完整性和电源完整性,确保设计满足电气性能要求。

  10. 软件和固件:开发或配置必要的软件和固件,以充分利用89HPES24T3G2的功能,包括通过串行EEPROM加载设备配置。

通过综合考虑这些因素,可以确保PCI Express开关解决方案能够满足高性能应用的需求,并实现最佳的系统性能和可靠性。

文档预览

下载PDF文档
24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Datasheet
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Device Overview
Features
u
u
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
u
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
u
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 50
December 16, 2013
DSC 6930

89HPES24T3G2ZBBL相似产品对比

89HPES24T3G2ZBBL 89HPES24T3G2ZCALG8 89HPES24T3G2ZCALGI 89HPES24T3G2ZCALG 89HPES24T3G2ZCALI 89HPES24T3G2ZBBLG8 89HPES24T3G2ZBBL8 89HPES24T3G2ZCAL
描述 FCBGA-676, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Tray FCBGA-676, Reel FCBGA-676, Reel FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 含铅 不含铅 含铅 含铅
是否Rohs认证 不符合 符合 符合 符合 不符合 符合 不符合 不符合
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
包装说明 27 X 27 MM, 1 MM PITCH, FCBGA-676 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-676 BGA, FCBGA-324
针数 676 324 324 324 324 676 676 324
制造商包装代码 BL676 ALG324 ALG324 ALG324 AL324 BLG676 BL676 AL324
Reach Compliance Code not_compliant compliant compliant compliant not_compliant compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI SMBUS PCI; SMBUS PCI PCI SMBUS SMBUS PCI
JESD-30 代码 S-PBGA-B676 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B676 S-PBGA-B676 S-PBGA-B324
JESD-609代码 e0 e1 e1 e1 e0 e1 e0 e0
长度 27 mm 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 19 mm
湿度敏感等级 4 4 4 4 4 4 4 4
端子数量 676 324 324 324 324 676 676 324
最高工作温度 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260 260 260 225 245 225 225
座面最大高度 3.22 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.22 mm 3.22 mm 3.42 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED 30
宽度 27 mm 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1 1 1 1
其他特性 ALSO REQUIRES 3.3V SUPPLY HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. - ALSO REQUIRES 3.3V SUPPLY - HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. ALSO REQUIRES 3.3V SUPPLY
最大时钟频率 125 MHz - 100 MHz 125 MHz 125 MHz - - 125 MHz
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - IDT (Integrated Device Technology)

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2278  2128  1893  1989  1294  46  43  39  41  27 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved