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89HPES24T3G2ZCALI

产品描述FCBGA-324, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小651KB,共51页
制造商IDT (Integrated Device Technology)
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89HPES24T3G2ZCALI概述

FCBGA-324, Tray

89HPES24T3G2ZCALI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明FCBGA-324
针数324
制造商包装代码AL324
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度19 mm
湿度敏感等级4
端子数量324
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,2.5,3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档解析

89HPES24T3G2是一款PCI Express®开关,它支持每个下游端口的PCI Express热插拔功能。以下是热插拔接口的工作方式以及它对系统稳定性的影响:

  1. 热插拔接口工作方式

    • 89HPES24T3G2利用外部I/O扩展器(例如PC主板上使用的扩展器)来支持每个下游端口的PCI Express热插拔功能。
    • 在系统重置和配置之后,如果需要修改热插拔输出的状态,89HPES24T3G2会生成一个SMBus事务到I/O扩展器,并带上所有输出的新值。
    • 每当热插拔输入状态改变时,I/O扩展器会生成一个中断,该中断会被89HPES24T3G2的IOEXPINTN输入引脚(GPIO的备选功能)接收。
    • 作为对I/O扩展器中断的响应,89HPES24T3G2会生成一个SMBus事务来读取I/O扩展器中所有热插拔输入的状态。
  2. 对系统稳定性的影响

    • 热交换能力:热插拔功能允许在不重启系统的情况下添加或移除PCI Express设备,这提高了系统的灵活性和可用性。
    • 中断管理:当热插拔事件发生时,通过I/O扩展器生成的中断允许系统软件及时响应硬件状态的变化,从而可以动态地调整资源分配和电源管理。
    • 电源管理:89HPES24T3G2支持PCI Power Management Interface specification (PCIPM 1.1),包括设备电源管理状态D0, D3hot和D3cold,以及PCI Express Active State Power Management (ASPM)链接状态,这有助于在热插拔设备时维持电源效率和系统稳定性。
    • 错误报告和容错:该设备具备高级错误报告功能和所有内部数据及控制RAM的SECDED ECC保护,这有助于检测和修复操作中的错误,减少热插拔操作可能引入的系统不稳定风险。
    • 可靠性和自主性:89HPES24T3G2能够监控链接的可靠性,并自主地改变链接速度以防止链接不稳定,这有助于在热插拔过程中保持系统的稳定性。

总的来说,89HPES24T3G2的热插拔接口设计为提高系统的灵活性和稳定性,同时减少热插拔操作对系统性能和可靠性的潜在负面影响。

文档预览

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24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Datasheet
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Device Overview
Features
u
u
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
u
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
u
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 50
December 16, 2013
DSC 6930

89HPES24T3G2ZCALI相似产品对比

89HPES24T3G2ZCALI 89HPES24T3G2ZCALG8 89HPES24T3G2ZCALGI 89HPES24T3G2ZCALG 89HPES24T3G2ZBBLG8 89HPES24T3G2ZBBL8 89HPES24T3G2ZBBL 89HPES24T3G2ZCAL
描述 FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-676, Reel FCBGA-676, Reel FCBGA-676, Tray FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 不含铅 含铅 含铅 含铅
是否Rohs认证 不符合 符合 符合 符合 符合 不符合 不符合 不符合
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
包装说明 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-676 BGA, 27 X 27 MM, 1 MM PITCH, FCBGA-676 FCBGA-324
针数 324 324 324 324 676 676 676 324
制造商包装代码 AL324 ALG324 ALG324 ALG324 BLG676 BL676 BL676 AL324
Reach Compliance Code not_compliant compliant compliant compliant compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI SMBUS PCI; SMBUS PCI SMBUS SMBUS PCI PCI
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676 S-PBGA-B324
JESD-609代码 e0 e1 e1 e1 e1 e0 e0 e0
长度 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 27 mm 19 mm
湿度敏感等级 4 4 4 4 4 4 4 4
端子数量 324 324 324 324 676 676 676 324
最高工作温度 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260 260 260 245 225 225 225
座面最大高度 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.22 mm 3.22 mm 3.22 mm 3.42 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
宽度 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 27 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1 1 1 1
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - - IDT (Integrated Device Technology)
最大时钟频率 125 MHz - 100 MHz 125 MHz - - 125 MHz 125 MHz
其他特性 - HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. - ALSO REQUIRES 3.3V SUPPLY HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY

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