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89HPES4T4ZBBCI

产品描述CABGA-144, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小529KB,共31页
制造商IDT (Integrated Device Technology)
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89HPES4T4ZBBCI概述

CABGA-144, Tray

89HPES4T4ZBBCI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
零件包装代码CABGA
包装说明CABGA-144
针数144
制造商包装代码BC144
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B144
JESD-609代码e0
长度13 mm
湿度敏感等级3
端子数量144
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA144,12X12,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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4-Lane 4-Port
PCI Express® Switch
®
89HPES4T4
Data Sheet
The 89HPES4T4 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES4T4 is a 4-lane, 4-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
Features
High Performance PCI Express Switch
– Four 2.5 Gbps PCI Express lanes
– Four switch ports
– x1 Upstream port
– Three x1 Downstream ports
– Low latency cut-through switch architecture
– Support for Max payload sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
4-Port Switch Core / 4 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
(Port 4)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
June 12, 2014

89HPES4T4ZBBCI相似产品对比

89HPES4T4ZBBCI 89HPES4T4ZBNQG 89HPES4T4ZBNQG8 89HPES4T4ZBBCGI8 89HPES4T4ZBBC 89HPES4T4ZBBC8 89HPES4T4ZBBCG 89HPES4T4BCGI
描述 CABGA-144, Tray VFQFPN-132, Tray VFQFPN-132, Reel CABGA-144, Reel CABGA-144, Tray CABGA-144, Reel CABGA-144, Tray CABGA-144, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 含铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 符合 符合 符合 不符合 不符合 符合 符合
零件包装代码 CABGA VFQFPN VFQFPN CABGA CABGA CABGA CABGA CABGA
针数 144 132 132 144 144 144 144 144
制造商包装代码 BC144 NQG132 NQG132 BCG144 BC144 BC144 BCG144 BCG144
Reach Compliance Code not_compliant compliant compliant compliant not_compliant not_compliant compliant compliant
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
包装说明 CABGA-144 QFN-132 QFN-132 LBGA, BGA144,12X12,40 CABGA-144 CABGA-144 LBGA, BGA144,12X12,40 -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
总线兼容性 PCI PCI PCI; SMBUS PCI; SMBUS PCI PCI; SMBUS PCI -
JESD-30 代码 S-PBGA-B144 S-XQCC-N132 S-XQCC-N132 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 -
JESD-609代码 e0 e3 e3 e1 e0 e0 e1 -
长度 13 mm 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm -
湿度敏感等级 3 3 3 3 3 3 3 -
端子数量 144 132 132 144 144 144 144 -
最高工作温度 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C -
封装主体材料 PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 LBGA HVQCCN HVQCCN LBGA LBGA LBGA LBGA -
封装等效代码 BGA144,12X12,40 LGA132,20X20,20 SLGA132,18X18,20 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 -
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE -
封装形式 GRID ARRAY, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE -
峰值回流温度(摄氏度) 225 260 260 260 225 225 260 -
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 1.5 mm 0.9 mm 0.9 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm -
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V -
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V -
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V -
表面贴装 YES YES YES YES YES YES YES -
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL -
端子面层 Tin/Lead (Sn63Pb37) Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) -
端子形式 BALL NO LEAD NO LEAD BALL BALL BALL BALL -
端子节距 1 mm 0.65 mm 0.65 mm 1 mm 1 mm 1 mm 1 mm -
端子位置 BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM -
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED 30 -
宽度 13 mm 10 mm 10 mm 13 mm 13 mm 13 mm 13 mm -
Base Number Matches 1 1 1 1 1 1 1 -
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology)

 
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