Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | CYLINDRICAL, O-MBCY-W3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 雪崩能效等级(Eas) | 240 mJ |
| 配置 | SINGLE WITH BUILT-IN DIODE |
| 最小漏源击穿电压 | 200 V |
| 最大漏极电流 (Abs) (ID) | 5.5 A |
| 最大漏极电流 (ID) | 5.5 A |
| 最大漏源导通电阻 | 0.36 Ω |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95代码 | TO-39 |
| JESD-30 代码 | O-MBCY-W3 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 3 |
| 工作模式 | ENHANCEMENT MODE |
| 最高工作温度 | 150 °C |
| 封装主体材料 | METAL |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 极性/信道类型 | N-CHANNEL |
| 最大功率耗散 (Abs) | 25 W |
| 最大脉冲漏极电流 (IDM) | 22 A |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 晶体管应用 | SWITCHING |
| 晶体管元件材料 | SILICON |
| Base Number Matches | 1 |

| IRHF3230 | IRHF4230 | IRHF7230PBF | IRHF8230PBF | IRHF8230 | |
|---|---|---|---|---|---|
| 描述 | Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 200V, 0.36ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-39, HERMETIC SEALED, TO-205AF, 3 PIN |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 包装说明 | CYLINDRICAL, O-MBCY-W3 | HERMETIC SEALED, TO-205AF, 3 PIN | CYLINDRICAL, O-MBCY-W3 | CYLINDRICAL, O-MBCY-W3 | TO-205AF, 3 PIN |
| Reach Compliance Code | compliant | compliant | compliant | compliant | not_compliant |
| 雪崩能效等级(Eas) | 240 mJ | 240 mJ | 240 mJ | 240 mJ | 240 mJ |
| 配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| 最小漏源击穿电压 | 200 V | 200 V | 200 V | 200 V | 200 V |
| 最大漏极电流 (ID) | 5.5 A | 5.5 A | 5.5 A | 5.5 A | 5.5 A |
| 最大漏源导通电阻 | 0.36 Ω | 0.36 Ω | 0.36 Ω | 0.36 Ω | 0.36 Ω |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95代码 | TO-39 | TO-39 | TO-39 | TO-39 | TO-39 |
| JESD-30 代码 | O-MBCY-W3 | O-MBCY-W3 | O-MBCY-W3 | O-MBCY-W3 | O-MBCY-W3 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 3 | 3 | 3 |
| 工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
| 最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| 封装主体材料 | METAL | METAL | METAL | METAL | METAL |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| 最大脉冲漏极电流 (IDM) | 22 A | 22 A | 22 A | 22 A | 22 A |
| 表面贴装 | NO | NO | NO | NO | NO |
| 端子形式 | WIRE | WIRE | WIRE | WIRE | WIRE |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| ECCN代码 | EAR99 | EAR99 | - | - | EAR99 |
| 最大漏极电流 (Abs) (ID) | 5.5 A | 5.5 A | - | - | 5.5 A |
| JESD-609代码 | e0 | e0 | - | - | e0 |
| 最大功率耗散 (Abs) | 25 W | 25 W | - | - | 25 W |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | - | - | Tin/Lead (Sn/Pb) |
| 厂商名称 | - | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
| 其他特性 | - | - | RADIATION HARDENED | RADIATION HARDENED | RADIATION HARDENED |
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