Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | PGA |
包装说明 | SPGA, |
针数 | 611 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.3 |
地址总线宽度 | 64 |
位大小 | 64 |
边界扫描 | NO |
最大时钟频率 | 1660 MHz |
外部数据总线宽度 | 128 |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | R-CPGA-P611 |
长度 | 113 mm |
低功率模式 | YES |
端子数量 | 611 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SPGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, SHRINK PITCH |
座面最大高度 | 5.368 mm |
速度 | 667 MHz |
表面贴装 | NO |
技术 | CMOS |
端子形式 | PIN/PEG |
端子节距 | 1.27 mm |
端子位置 | PERPENDICULAR |
宽度 | 48.26 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
Base Number Matches | 1 |
NE80567KE025009 | NE80567KF028009 | NE80567KF028015 | NE80567KEB17003 | NE80567KF0288M | NE80567KE025003 | NE80567KE025015 | |
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描述 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 | Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | PGA | PGA | PGA | PGA | PGA | PGA | PGA |
包装说明 | SPGA, | SPGA, | SPGA, | SPGA, | SPGA, | SPGA, | SPGA, |
针数 | 611 | 611 | 611 | 611 | 611 | 611 | 611 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
地址总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
位大小 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
边界扫描 | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 1660 MHz | 1660 MHz | 1660 MHz | 1660 MHz | 1660 MHz | 1660 MHz | 1660 MHz |
外部数据总线宽度 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-CPGA-P611 | R-CPGA-P611 | R-CPGA-P611 | R-CPGA-P611 | R-CPGA-P611 | R-CPGA-P611 | R-CPGA-P611 |
长度 | 113 mm | 113 mm | 113 mm | 113 mm | 113 mm | 113 mm | 113 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES |
端子数量 | 611 | 611 | 611 | 611 | 611 | 611 | 611 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | SPGA | SPGA | SPGA | SPGA | SPGA | SPGA | SPGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH | GRID ARRAY, SHRINK PITCH |
座面最大高度 | 5.368 mm | 5.368 mm | 5.668 mm | 5.668 mm | 5.368 mm | 5.668 mm | 5.668 mm |
速度 | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
宽度 | 48.26 mm | 48.26 mm | 48.26 mm | 48.26 mm | 48.26 mm | 48.26 mm | 48.26 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
厂商名称 | - | - | - | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
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