16-BIT, 100MHz, OTHER DSP, PBGA144, PLASTIC, BGA-144
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA144,13X13,32 |
| 针数 | 144 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | 23 |
| 桶式移位器 | YES |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 100 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B144 |
| 长度 | 12 mm |
| 低功率模式 | YES |
| 端子数量 | 144 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA144,13X13,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 32768 |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 12 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320LC549GGU-50 | TMS320LC549GGU-40 | TMS320LC549PGE-40 | TMS320LC549PGE-50 | |
|---|---|---|---|---|
| 描述 | 16-BIT, 100MHz, OTHER DSP, PBGA144, PLASTIC, BGA-144 | 16-BIT, 100MHz, OTHER DSP, PBGA144, PLASTIC, BGA-144 | 16-BIT, 100MHz, OTHER DSP, PQFP144, PLASTIC, QFP-144 | 16-BIT, 100MHz, OTHER DSP, PQFP144, PLASTIC, QFP-144 |
| 零件包装代码 | BGA | BGA | QFP | QFP |
| 包装说明 | LFBGA, BGA144,13X13,32 | LFBGA, BGA144,13X13,32 | LFQFP, | LFQFP, |
| 针数 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 23 | 23 | 23 | 23 |
| 桶式移位器 | YES | YES | YES | YES |
| 边界扫描 | YES | YES | YES | YES |
| 最大时钟频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B144 | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G144 |
| 长度 | 12 mm | 12 mm | 20 mm | 20 mm |
| 低功率模式 | YES | YES | YES | YES |
| 端子数量 | 144 | 144 | 144 | 144 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFQFP | LFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | QUAD | QUAD |
| 宽度 | 12 mm | 12 mm | 20 mm | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 |
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