64-BIT, 100MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA548,26X26,32 |
| 针数 | 548 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 20 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 100 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B548 |
| JESD-609代码 | e0 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| 端子数量 | 548 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA548,26X26,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 1.2,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 16384 |
| 座面最大高度 | 2.8 mm |
| 最大供电电压 | 1.26 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320DM643GDK500 | TMS320DM643ZNZ500 | TMS320DM643GNZ600 | TMS320DM643GDK600 | TMS320DM643GNZ500 | |
|---|---|---|---|---|---|
| 描述 | 64-BIT, 100MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548 | Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA | 64-BIT, 133MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548 | Video/Imaging Fixed-Point Digital Signal Processor 548-FC/CSP | IC 64-BIT, 100 MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548, Digital Signal Processor |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, BGA548,26X26,32 | BGA, BGA548,26X26,40 | BGA, BGA548,26X26,40 | FBGA, BGA548,26X26,32 | BGA, BGA548,26X26,40 |
| 针数 | 548 | 548 | 548 | 548 | 548 |
| Reach Compliance Code | compliant | compliant | compliant | not_compliant | not_compliant |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 100 MHz | 50 MHz | 133 MHz | 133 MHz | 100 MHz |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | SINGLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 | S-PBGA-B548 |
| 长度 | 23 mm | 27 mm | 27 mm | 23 mm | 27 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 端子数量 | 548 | 548 | 548 | 548 | 548 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | BGA | BGA | FBGA | BGA |
| 封装等效代码 | BGA548,26X26,32 | BGA548,26X26,40 | BGA548,26X26,40 | BGA548,26X26,32 | BGA548,26X26,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY, FINE PITCH | GRID ARRAY |
| 峰值回流温度（摄氏度） | 220 | NOT SPECIFIED | 220 | 220 | 220 |
| 电源 | 1.2,3.3 V | 1.2,3.3 V | 1.4,3.3 V | 1.4,3.3 V | 1.2,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 16384 | 4096 | 16384 | 16384 | 16384 |
| 座面最大高度 | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm |
| 最大供电电压 | 1.26 V | 1.26 V | 1.44 V | 1.44 V | 1.26 V |
| 最小供电电压 | 1.14 V | 1.14 V | 1.36 V | 1.36 V | 1.14 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.4 V | 1.4 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 1 mm | 1 mm | 0.8 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 23 mm | 27 mm | 27 mm | 23 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| ECCN代码 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | - | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 20 | - | 20 | 20 | 20 |
| 外部数据总线宽度 | 64 | - | 64 | 64 | 64 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 湿度敏感等级 | 4 | - | 4 | 4 | 4 |
| 最高工作温度 | 90 °C | - | 90 °C | 90 °C | 90 °C |
| 温度等级 | OTHER | - | OTHER | OTHER | OTHER |
| 端子面层 | TIN LEAD | - | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Base Number Matches | 1 | 1 | 1 | - | - |
stm32/stm8
ADI 工业技术
微控制器 MCU
微控制器 MCU
测评中心专版
模拟电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
