EEPROM, 1KX8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | LEAD FREE, TSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3/e2 |
| 长度 | 4.4 mm |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.25 mm |
| 串行总线类型 | SPI |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | TIN/TIN COPPER |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| BR25H080FVT-WE2 | BR25H040FVT-WE2 | BR25H010FVM-WTR | BR25H020FVT-WE2 | BR25H160FVT-WE2 | BR25H080FV-WE2 | BR25H010FVT-WE2 | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 1KX8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD FREE, MSOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, LEAD FREE, SSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | MSOP | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | LEAD FREE, TSSOP-8 | LEAD FREE, TSSOP-8 | LEAD FREE, MSOP-8 | LEAD FREE, TSSOP-8 | LEAD FREE, TSSOP-8 | LEAD FREE, SSOP-8 | LEAD FREE, TSSOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3/e2 | e3/e2 | e3/e2 | e3/e2 | e3/e2 | e3/e2 | e3/e2 |
| 长度 | 4.4 mm | 4.4 mm | 2.9 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 内存密度 | 8192 bit | 4096 bit | 1024 bit | 2048 bit | 16384 bit | 8192 bit | 1024 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 1024 words | 512 words | 128 words | 256 words | 2048 words | 1024 words | 128 words |
| 字数代码 | 1000 | 512 | 128 | 256 | 2000 | 1000 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1KX8 | 512X8 | 128X8 | 256X8 | 2KX8 | 1KX8 | 128X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | VSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.25 mm | 1.25 mm | 0.9 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.25 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 宽度 | 3 mm | 3 mm | 2.8 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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